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題 名 | 氧/氫/氮電漿對混合有機矽氧烷聚合物之介電物性效應(2)=The Impact of Oxygen/Hydrogen/Nitrogen Plasmas on Dielectric and Physical Properties of Hybrid Organic Silsesquioxane Polymer (Part 2) |
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作 者 | 陳錦山; 陳松德; 楊聰仁; 林中魁; | 書刊名 | 真空科技 |
卷 期 | 15:4 2002.11[民91.11] |
頁 次 | 頁25-33 |
分類號 | 440.33 |
關鍵詞 | 霍氏轉換紅外線光譜術; 旋塗; 混合有機矽氧烷聚合物; 電漿處理; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究繼上期(15卷3期,Part 1)探討混合有機矽氧烷聚合物(HOSP)低介電薄膜在不同單一電漿環境下之行為,將進一步利用難氏轉換紅外線光譜術(FTIR)分析HOSP介電層在各種含氮電漿環境下的保護與鈍化行為。掠角(Grazing Angle)X光繞射分析証實HOSP薄膜為非晶質(Amorphous)結構,但HOSP介電層經過短時間(≦5分)之氧電漿處理後,掠角X光繞射分析發現薄膜仍保持非晶質結構,但FTIR分析卻證實薄膜內部鍵結已遭受到嚴重的破壞,包括Si-CH3、Si-H與C-H等低偏極化鍵結數量大幅降低與導致網狀╱籠狀Si-O鍵結產生變化,使得HOSP薄膜之薄膜性質往傳統介電層薄膜(即SiO2)趨近。但是,經過適當“塗敷”術處理後,HOSP薄膜明顯的不會遭到氧電漿的破壞,仍能維持相當穩定的鍵結。同時,我們也在開發創新的表面工程技術,以便保護低k介電薄膜以免遭“惡劣”電漿環境的損傷,而且亦具有成為擴散阻礙層之潛力。 |
英文摘要 | This work investigates the spin-on coating process of hybrid organic siloxane polymer (HOSP), and employs Fourier transform infrared spectroscopy (FTIR) and Grazing Angle X-ray diffraction examine the effect of oxygen plasma and various capping treatments on structure, electrical and bonding properties of low-k (2.5) HOSP thin films. However, they suffer a serious bonding damage upon treating at oxygen plasma (ashing) for a short period of less than 5 min. This treatment causes a series of breaking bonds of Si-O, Si-CH3, and C-H, rendering the k value of HOSP films to rise sharply. However, HOSP films could be strengthened by another surface engineering technology, which effectively passivates the surface of HOSP. Therefore, adequately passivated HOSP thin films can be subjected to oxygren ashing without suffering from a bond breaking, and thus would maintain a low value of k. Moreover, we are currently developing an innovative plasma method aiming at forming a passivation layer, potentially also serving as a reliable diffusion barrier. |
本系統中英文摘要資訊取自各篇刊載內容。