查詢結果分析
來源資料
相關文獻
- 添加單壁奈米碳管對Sn-Ag銲料之微結構與機械性質之影響
- Ni粉末添加對Sn-Ag銲料銲點的接合強度之研究
- 無鉛波銲製程及微結構分析
- Fine-Structure Superplasticity in Materials
- 氫氧基磷灰石/鈦磁控濺鍍膜微結構及性質研究
- 微結構之合金電鑄技術
- Mn-Cu-Ni合金球墨鑄鐵的沃斯回火特性
- 粉末高速鋼之鍛造變數與顯微結構研究
- The Composite Structure Affect on the Mechanical Properties of Ni-25Al-xFe Intermetallics
- Comparison of Transmissible Venereal Tumor Cells with Histiocytoma and Lymphoma Cells
頁籤選單縮合
題 名 | 添加單壁奈米碳管對Sn-Ag銲料之微結構與機械性質之影響=Effect of SWCNTs Addition on the Microstructure and Mechanical Properties of Sn-Ag Solder |
---|---|
作 者 | 林時宇; 李洋憲; | 書刊名 | 南臺學報 |
卷 期 | 34:1 2009.07[民98.07] |
頁 次 | 頁23-31 |
分類號 | 472.14 |
關鍵詞 | 複合銲料; 單壁奈米碳管; 金屬間化合物; 微結構; 銲點; SWCNTs; IMC; Composite solder; Single-wall carbon nanotubes; Interfacial intermetallic; Microstructure; Solder joints; |
語 文 | 中文(Chinese) |
中文摘要 | 在電子構裝中銲料和基板間之金屬間化合物層(IMC)之反應,已經成為重要的議題之一。本實 驗主要是利用散佈強化的概念,來改善並且強化銲錫的機械性質之方式。以Sn-3.5Ag 的錫膏中添加單 壁奈米碳管(SWCNTs)粉末,然後以機械攪拌方式使粉末顆粒均勻散佈於錫膏內,藉以形成複合銲 料來強化Sn-3.5Ag 之基地組織。接著,觀察金屬間化合物層之形貌及成長機制以及利用光學顯微鏡 (OM)、掃描式顯微鏡(SEM)、EDX、DSC、XRD 及微負荷拉伸試驗機,來探討銲點間所形成之 金屬間化合物層之結合強度、剪切強度等機械性質。而在研究中發現到,隨著SWCNTs 粉末的增加, 在銲點之微結構會隨著持溫後而變得較為粗大;此外,微硬度會明顯的提昇,並且剪切強度比未添加 要好,以及當熱儲存過程中剪切強度會因時間的增加而降低,也隨著SWCNTs 粉末的增加而有所改變。 |
英文摘要 | The effect of solder on intermetallic compounds has come to be one of the critical issues in the field of electronic package. This study aims at improving and strengthening the mechanical properties of lead-free solder by the concept of distribution of the reinforcing phase. Single-wall Carbon nanotubes powder (SWCNTs) was first put into lead-free solder paste and then was stirred so that it was well-distributed in the lead-free solder paste to formed composite solder alloy. Next, the microstructure features and growth mechanism of the composite solder was observed by means of optical microscope (OM), scanning electron microscope (SEM), energy dispersive X-ray (EDX), DSC, XRD, and Micro load stretch testing machine to investigate the mechanical properties of its intermetallic compounds, such as joint strength, shear strength, etc. The study found that through the addition of the SWCNTs powder, the microstructure of the solder joints became thicker and bigger after aging. Furthermore, the strength of the microhardness was significantly increased. Shear tests results revealed that as-soldered and aged composite solder joints had better shear strength than non-composite solder joints. The shear strength of all aged solder joints decreased with increasing thermal aging time. Key words: composite |
本系統中英文摘要資訊取自各篇刊載內容。