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題名 | Ni粉末添加對Sn-Ag銲料銲點的接合強度之研究=Study of Adhesive Strength of Sn-Ag-xNi Solder Joint |
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作 者 | 李洋憲; | 書刊名 | 南臺科技大學學報 |
卷期 | 30 民94.12 |
頁次 | 頁69-76 |
分類號 | 472.14 |
關鍵詞 | 複合銲料; 微結構; 接合強度; 金屬間化合物; Composite solder; Microstructure; Adhesive strength; Intermetallic compound; IMC; |
語文 | 中文(Chinese) |
中文摘要 | 本研究以in-situ方式於Sn-3.5 wt%Ag之無鉛銲錫內添加0.5-3wt%重量百分比之Ni粉末,製作成含Ni粉末的複合銲錫,並探討其對微結構變化和接合強度之影響。實驗結果發現Ni粉末添加,會有金屬間化合物Ni3Sn4析出散佈於銲錫基地內;而銲點之接合強度於未持溫儲存情況下,會因鎳添加而得到改善。而於熱儲存情況下所有的銲點之接合強度呈現下降趨勢。從銲點於熱儲存拉伸試驗之試件測試結果Sn-Ag-0.5%Ni銲點呈現為混合部份延性及脆性破壞。而當鎳粉未添加量超過1%以上,則主要為脆性破壞於介面上,破壞表面有大面積(Cu, Ni)6Sn5層以及少量殘餘銲錫。 |
英文摘要 | This study forms composite solders by adding 0.5 to 3wt% of Ni particles in-situ to Sn-3.5wt%Ag lead-free solder. The experimental results reveal that the addition of Ni to the molten Sn-Ag solder leads to the formation of in-situ Ni3Sn4 dispersions. The adhesive strength of the joint is found to increase with increasing Ni content in the as-soldered specimens. In general, the strength of the hermally processed specimens reduces as the thermal storage time increases. The Sn-Ag-0.5wt%Ni joint showed a mixture of ductile and brittle fracture, where the joints containing more than 1wt% of Ni show mainly brittle fracture with solder residue at the exposed (Cu, Ni)6Sn5 IMC layer. |
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