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題 名 | 電泳沉積法製備氧化鋯陶殼模於導電塑膠基材之研究=Fabrication of Zirconia Ceramic Shell Mold on the Conductive Plastic by Electrophoretic Deposition |
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作 者 | 謝杰廷; 林育則; 黃聖閔; 蔡佳宏; 邱弦文; 楊國和; | 書刊名 | 鑄造工程學刊 |
卷 期 | 34:4=139 2008.12[民97.12] |
頁 次 | 頁47-52 |
分類號 | 472.22 |
關鍵詞 | 電泳沉積; 陶殼模; 表面粗糙度; Electrophoretic deposition; Ceramic shell mold; Surface roughness; |
語 文 | 中文(Chinese) |
中文摘要 | 電泳沉積法具設備簡易、低成本、高沉積速率等優點廣泛應用於陶瓷薄膜的製備。本研究擬利用電泳沉積法在導電塑膠基材上沉積ZrO2面層陶殼模,待其乾燥後再反覆進行沾漿、淋砂、乾燥作業以得具一定厚度之陶殼模。藉由控制輸出電壓、沉積時間探討其對電泳沉積行為的影響,並應用表面粗度儀量測基材與陶殼模之表面粗糙度,分析電泳沉積與一般傳統沾漿、淋砂作業所製備之陶殼模表面品質的差異。 |
英文摘要 | The advantages of using electrophoretic deposition (EPD) process are simple facilities, low cost, and high deposition rate. Nowadays, EPD becomes widely used for making ceramic film. In this study, EPD process was used to make ZrO2 primary coat on the conductive plastic, then the primary coat was set for drying after EPD process. The conventional shell making process, including dipping , stuccoing and drying , was conducted and repeated for several times, till a specific thickness of ceramic shell mold were obtained. The effects of the applied voltage and deposition time on the deposition behavior of solutions were examined. Both the surface roughness of the ceramic shell molds made by EPD process and conventional shell making process were measured and compared. |
本系統中英文摘要資訊取自各篇刊載內容。