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題名 | 有限元素方法於塑膠球型陣列構裝之熱傳特性分析=FEM Applications in the Analysis of PBGA Thermal Characterization |
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作者 | 張嘉隆; 劉坤孝; Chang, Chia-lung; Liu, Kun-hsiao; |
期刊 | 技術學刊 |
出版日期 | 20000600 |
卷期 | 15:2 2000.06[民89.06] |
頁次 | 頁283-289 |
分類號 | 448.5 |
語文 | chi |
關鍵詞 | 熱阻; 有限元素法; PGBA; Thermal resistance; FEM; |
中文摘要 | 塑膠球型陣列構裝(PBGA)因其功能增多,尺寸較小之特性,漸被重視;然其單位面積所散發的熱量隨之增加,熱傳特性分析是重要設計關鍵。本文以有限元素方法建立PBGA分析模型,模擬其在自然及強迫對流環境下之溫度分佈及計算熱阻值,所得熱阻與實驗量測值作比較,二者十分接近。並以經驗証的分析模型建立構裝材質及厚度之參數模型,探討構裝材質及厚度對熱阻之影響。結果顯示、銀膠厚度及熱傳材質之改變對熱阻影響不大,膠體厚度之增加或膠體熱傳導係數之增加皆可降低熱阻值。 |
英文摘要 | Plastic ball grid array (PBGA) packages have generated significant interest in the market recently, because the packages get more function from less size. While the dissipated power per unit area increases, the analysis of the thermal characterization is more important. The PBGA analysis models are built by the finite element method (FEM) to simulate the temperature distribution of the package under the natural and forced convection of the operating conditions, then the thermal resistance of the package is calculated. Compared with the thermal resistance from experimental measurement, the simulated values are quite close to the experimental values. The material properties and thicknesses of the package components were built with parameter variables by the verified model to study the effect of the material properties and thicknesses on the thermal resistance of the package. The results indicate that the change of both thickness and thermal conductivity of die adhesive has little effect on the thermal resistance of the package and increasing either thickness or thermal conductivity of the molding compound can reduce the thermal resistance of the package. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。