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題 名 | Solid State and Transient Liquid Phase Diffusion Bonding of an Al-Zn-Mg Alloy=鋁鋅鎂合金之固相與過渡液相擴散接合 |
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作 者 | 楊智富; 邱六合; 李世昌; 孫如瑩; | 書刊名 | Proceedings of the National Science Council : Part A, Physical Science and Engineering |
卷 期 | 22:1 1998.01[民87.01] |
頁 次 | 頁132-141 |
分類號 | 440.39 |
關鍵詞 | 鋁鋅鎂合金; 擴散接合; Diffusion bonding; Transient liquid phase; Superplastic 7475 Al alloy; Electroplating; Zinc interlayer; |
語 文 | 英文(English) |
中文摘要 | 本研究針對航太工業材料超塑性 7475 鋁合金之擴散接合進行探討,其接合方式 包括固相擴散接合和過渡液相擴散接合兩種。其中過渡液相擴接合之方式乃是以鋅金屬作為 中間夾層, 而中間層除了使用 20 μ m 之鋅箔外,亦有利用 7475 板料表面處理後電渡鋅 來達到目的,試片之表面處理則以鋅置換方式作前處理以防止母材表面形成緻密之氧化膜阻 礙接合,並經由 XRD、GDOS 和 OM 來作表面分析;而固相擴散接合則不需中間夾層。 擴散 接合條件包括:試片之表面粗糙度( Rm )為 1.85 μ m 和 8.6 μ m,夾層鋅膜厚分別由 0 到 20 μ m,並在 760、10 □和 10 □ torr 之不同真空環境下進行,於 515 ℃和 530 ℃,1-3 MPa 壓力下作 0.5 到 6 小時之靜壓接合研究;接合後試片藉由接合面之微觀組織 觀察以及剪力強度測試加以評估。實驗結果顯示,經由適當的接合條件和表面處理,固相擴 散接合之 7475 鋁合金接合強度可高達 90% 以上之母材強度。 |
英文摘要 | In this study two bonding techniques are studies using a superplastic 7475 Al alloy, including solid state diffusion bonding (SSDB) and transient liquid phase bonding (TLPB) using a thin Zn interlayer. Interlayers of Zn measuring 20 μm in thickness for TLPB were obtained using a mill rolling process while Zn interlayers with thickness equal to or less than 10 μm were obtained by direct electroplating of Zn onto the 7475 al Alloy. Diffusion bonding of 7475 Al alloy specimens was carried out under a variety of bonding parameters, including surface roughness of 1.85 and 8.6 μm in the Rm scale, a degree of vacuum of 760, 10□ and 10□ torr, uniaxial pressures of 1,2 and 3 MPa, bonding times from 0.5 to 6 hours, bonding temperatures of 515 and 530℃ and zinc interlayers 0 to 20 μm in thickness. Characterizations of zinc coatings and the chemical species absorbed in or formed on the surface layer of 7475 Al alloy specimens were obtained using XRD, GDOS and optical microscopy. The integrity of the bonds was examined using optical microscopy, and the bond strengths were evaluated using a single overlap shear test. The results show that, with proper bonding conditions and surface pre-treatment, successful bonds with lap shear stress (in a T6 condition) greater than 90% of that of the parent alloy could be achieved by means of solid state diffusion bonding. |
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