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題名 | 多層板構裝結構中平行連通柱的耦合效應=The Coupling Effect of Parallel Type Vias in Multi-Layered Packaging |
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作者 | 許壽國; 吳瑞北; | 書刊名 | 技術學刊 |
卷期 | 13:1 1998.03[民87.03] |
頁次 | 頁77-84 |
分類號 | 448.57 |
關鍵詞 | 電子構裝; 連通柱; 串音雜訊; 耦合效應; Electronic packaging; Vias; Crosstalk noise; Coupling effect; |
語文 | 中文(Chinese) |
中文摘要 | 訊號流經多層構裝結構中的連通柱時,會激發徑向波模態沿徑向傳播,並耦合 到其他連通柱而在另一導線上產生串音雜訊。本研究分析在多層板構裝結構中,兩相毗鄰的 平行穿孔連通柱的耦合效應。本文的數值結果將研究不同的連通柱間距對耦合特性所造成之 影響,以及串音效應的探討。 |
英文摘要 | When a signal propagates along a via in a multi-layer environment, it excites a cylindrical wave propagating along the radial direction and generates coupled crosstalk noise through other vias. The high-freguency electromagnetic coupling effects of the neighboring parallel type vias in a multi-layered packaging environment are investigated by employing full wave analysis. Numerical results are included to illustrate the frequency dependence coupling characteristics and cross talk effects for via structures with various spacing between neighboring vias. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。