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題名 | Analysis on Surface Properties of the Electroless Plated Cu/Al[feaf]O[feb0]Catalysts Prepared by Incipient Wetness Impregnation=微濕含浸法製備無電鍍銅觸媒之金屬表面特性分析 |
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作者 | 林文雄; 張新福; 黃建堯; | 書刊名 | 建國學報 |
卷期 | 16 1997.06[民86.06] |
頁次 | 頁195-203 |
分類號 | 472.16 |
關鍵詞 | 微濕含浸法; 無電鍍銅; 程溫還原; Incipient wetness impregnation; Electroless copper; Temperature-programmed reduction; TPR; |
語文 | 英文(English) |
中文摘要 | 本研究以微濕含浸法(Incipient wetness impregnation)將鈀種植在載體上,取代無電鍍銅製備之前處理過程:敏化、活化及還原步驟,製備不同鈀、銅含量之銅觸媒。實驗結果發現,當載體上鈀含量達0.67wt%,析鍍上去的銅含量有一極值。由程溫還原(TPR)圖譜發現,鈀含量增加時,氧化銅的還原溫度有往低溫移動之趨勢,顯示鈀、銅兩種金屬間有交互作用存在。 |
英文摘要 | This study employed incipient wetness impregnation to deposite palladium instead of predip, activation and reduction pretreatment steps to prepare the electroless copper catalyst of different palladium and copper loadings. The experiment results showed that the copper loading reaches a maximum when palladium loading is 0.67 wt%. The reduction temperature of CuO decreased with the increase of palladium loading, indicating the interaction between palladium and copper. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。