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題 名 | 無電鍍銅觸媒之銅表面積及對醇類之脫氫反應之影響=The Copper Surface Area of Electroless Plated Cu/Al[feaf]O[feb0]Catalysts and Its Effect on the Alcohol Dehydrogenation Reactions |
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作 者 | 林文雄; 鄒岳樺; 張新福; | 書刊名 | 技術學刊 |
卷 期 | 12:3 1997.09[民86.09] |
頁 次 | 頁463-470 |
分類號 | 472.16 |
關鍵詞 | 無電鍍; 銅表面積; 脫氫反應; 結構敏感反應; Electroless; Copper surface area; Dehydrogenation; Structure-sensitivity; |
語 文 | 中文(Chinese) |
中文摘要 | 利用無電鍍法製備以氧化鋁為載體之不同析鍍量銅觸媒,並自行裝設真空熱控 系統,以氧化亞氮為化學吸附質量測銅表面積。並利用一連續式微反應器分別對異丙醇、 丁醇及環己醇進行脫氫反應,反應產物以連線之氣相層析儀分析。實驗結果,銅表面積於 析鍍量15wt%之前,隨析鍍量增加而增加,而後,則隨析鍍增加而依次漸減。由轉化頻率 與分散度的關係得知,上述醇類之脫氫反應顯示輕微結構敏感。 |
英文摘要 | Several copper/alumina catalysts with different copper loadings were prepared by the electroless copper plating menthod. The copper surface area was measured by the selective chemisorption of nitrous oxide using the volumetric method in a self-setup vacuum and thennal control system. The dehydrogenations of isopropanol, butanol and cyclohexanol were carried out in a fixed-bed microreactor, and an on-line gas chromatograph was used to analyze the products. The experimental results showed that the copper surface area increased with copper loading up to ca. 15wt% and then decreased with further deposits. The variation of dispersion on turnover frequency showed that dehydrogenations of isopropanol, butanol and cyclohexanol exhibit a slight structure-sensitive effect. |
本系統中英文摘要資訊取自各篇刊載內容。