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題 名 | 聚四氟乙烯之表面改質與金屬化--濕式化學法與乾式電漿法之比較=Surface Modification and Metallization of PTFE-A Comparison of Wet Chemical Treatment and Plasma Treatment |
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作 者 | 林智汶; 黃炳照; 許文政; | 書刊名 | 材料科學 |
卷 期 | 29:3 1997.09[民86.09] |
頁 次 | 頁147-155 |
分類號 | 440.34 |
關鍵詞 | 聚四氟乙烯; 化學分析電子能譜儀; 二次離子質譜儀; 無電電鍍; 磁控濺射; PTFE; ESCA; SIMS; Electroless plating; Sputtering; |
語 文 | 中文(Chinese) |
中文摘要 | 本篇是研究聚四氟乙烯表面分別以濕式化學法或乾式電漿法處理後,藉由原子 力顯微鏡( AFM )、電子顯微鏡( SEM )來觀察試片處理前後的表面型態,以及以化學分 析電子能譜儀( ESCA )、二次離子質譜儀( SIMS )來分析試片處理前後的表面性質,也 藉由接觸角量測來評估聚四氟乙烯的表面能。經由不同方式處理聚四氟乙烯試片後,接著亦 分別以濕式無電電鍍法及乾式磁控濺射法沈積金屬銅層,並比較其沈積金屬之附著特性。濕 式處理後表面呈現龜裂狀,乾式處理後呈現類似海綿狀。二次離子質譜儀對試片的表面分析 中,證實在濕式處理後會有殘留的鈉在基材表面 C 乾式法處理之蝕刻效果會隨操作的功率 增加而增加,且基材經氬氣電漿處理後,濺射鍍銅的附著性皆優良。 |
英文摘要 | A comparison of surface modification and metallization on the PTFE surface via a wet chemical treatment and a plasma treatment was made. The wet process included a pretreatment using Na/naphthalene in THF solution as an etchant followed by an electroless plating. The dry process included Ar-and N □ -plasma pretreatment followed by a copper deposition by a magnetron sputtering. The surface textures after the pretreatments were compared by means of AFM and SEM. The chemical changes of the surface wer analyzed by ESCA、SIMS and a measurement of contact angle. The direct comparison of copper adhesion was also performed. Although the wet process resulted in a more pronounced change in both F/C ratio and contact angle a better copper adhesion by the plasma treatment was found. |
本系統中英文摘要資訊取自各篇刊載內容。