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頁籤選單縮合
題名 | 無電鍍鎳反應行為及實驗速率式之探討=Studies on Electroless Nickel Plating: Effects of Variables on Deposit Properties and an Empirical Rate Law |
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作者 | 王榮英; | 書刊名 | 技術學刊 |
卷期 | 12:3 1997.09[民86.09] |
頁次 | 頁457-462 |
分類號 | 472.16 |
關鍵詞 | 無電鍍鎳; 鍍率; 錯合劑; Electroless nickel plating; Deposition rate; Ligand; |
語文 | 中文(Chinese) |
中文摘要 | 本文以次亞磷酸鈉為還原劑,以醋酸鈉為錯合劑,有系統的研究在銅基材上無 電鍍鎳之非均勻相反應行為。改變六種動力變數(反應時間、鎳鹽濃度、還原劑濃度、錯 合劑濃度、pH值以及溫度)來觀察其對反應速率的影響;以獲取較佳鍍率及提高鍍浴穩定 性為原則,提出最適之操作條件與反應物濃度。並於適當之動力變數操作範圍內,找出其 實驗之速率式。此速率式將有助於對鍍浴的管理與鍍層的控制,及預測反應速率隨反應變 數之變他情形,提供實際生產操作之預測參考。 |
英文摘要 | This paper presents the results of studies carried out on the electroless deposition of nickel on a copper substrate by using sodium hypophosphite as a reducing agent and sodium acetate as a complexing agent. The effect of various process parameters such as time, temperature, concentrations of nickel ions, reluctant, ligand and pH value on the deposition rate were studied in detail. Optimum bath composition and operating conditions were selected by considering bath stability and high deposition rate without impairing the quality of the coating. An empirical relationship, correlating the rate of deposition and concentrations of nickel ions, reducing agent, ligand, and temperature, showed good agreement with the experimental values. |
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