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題 名 | 功能性聚氨基甲酸酯改質高性能環氧樹脂之研究=Modification of High Performance Epoxy Resin with Functional Polyurethane |
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作 者 | 汪輝雄; 陳俊傑; | 書刊名 | 材料科學 |
卷 期 | 28:2 1996.06[民85.06] |
頁 次 | 頁87-97 |
分類號 | 467.41 |
關鍵詞 | 改質環氧樹脂; 聚氨基甲酸酯; 偶合劑; Modification of epoxy resin network; Polyurethane; Coupling agent; |
語 文 | 中文(Chinese) |
中文摘要 | 本文主要是以具高韌性的聚氨基甲酸酯(PU)來增韌高溫型環氧樹脂系 統,並利用不同末端基的鏈偶合劑來結合聚氨基甲酸酯和環氧樹脂鏈節,以改善 其界面特性。此研究先以醚型及酯型聚二醇(PTMG 2000,PBA 2000)與4,4-甲基 聯苯二異氰酸(MDI)合成聚氨基甲酸酯(PU)寡聚合體後再藉不同鏈偶合劑 Bisphnol A(Bis-A)及DDS(4,4'-dIamino-diphenolsulfone)和環氧樹脂寡聚合體預反應 後加入HT976硬化劑加以交鏈;從實驗結果顯示,不同的聚二醇及鏈偶合劑對環氧 樹脂增韌的效果及物性影響甚鉅。 在樹脂交鏈反應之DSC研究中顯示,由於PU的導入滯礙了環氧樹脂和硬化劑間的 反應速率,將使反應放熱峰往高溫移動。且其凝膠時間隨著PU鏈節的導入而延 遲。 從交鏈樹脂CT試片破壞表面掃描式電子顯微鏡觀察顯示出,醚型PU改質交鏈環 氧樹脂有明顯的應力白化現象及0.5~4.0μm的微孔相分離形態;從動態機械性質 可以看出環氧樹脂的玻璃轉仕溫度Tg隨著PU之添加而有下降之趨勢,且酯型PU 比醚型PU改質環氧樹脂將較明顯降低環氧樹脂的交鏈密度,同時亦有較低的玻 璃轉位溫度;此外,交鏈環氧樹脂之β緩和溫度顯示Bis-A比DDS偶合劑使PU和交 鏈環氧樹脂有較明顯的相分離效果並從破壞韌性(GIC)測試得之其有較佳的裂縫 抵抗能力;並從抗張機械性質顯示,改質交鏈環氧樹脂的抗張模數隨著PU的添加 而下降,斷裂伸長率則隨著PU的添加而上昇。 |
英文摘要 | In the present study, we attempted to toughen the epoxy network using polyurethane(PU)as the modifier. The problem of chemically linking the modifier to the epoxy network was overcome by using Bisphenol A(Bis-A)or 4,4'-diaminodiphenyl sulphone(DDS ) as a cou-pling agent between the PU and the epoxy oligomer. Phenolic hydroxyl-terminated (HTPU)and aromatic amine-terminated(ATPU)PU modi-fiers were prepared by reaction two different macroglycols(PTMG,polytetramethylene gly-col, Mn=2000 and PBA, polybutylene adipate, Mn=2000) with 4,4'-Diphenylmethanediisocyanate (M.DI), then further coupling with two different coupling agents Bisphenol A orDDS respectively. These types of PU prepolymers were used to modify the epoxy resin with4,4'-diaminodiphenyl sulphone(HT-976)as a curing agent. From the experimental results, it was shown that the values of fracture energy, GIc for PU-modified epoxy were dependent on the macroglycols and the coupling agents. Scanning electron microscopy (SEM)revealed that the ether type (PTMG)of PU modified epoxy showed the present of an aggregated separated phase was varied between 0.5μm and 4μm in the ATPU(PTMG) modified system and between 1μm and 1.5μm in HTPU(PTMG) modified system. On the contrary, the ester type (PBA) PU-modified epoxy resinshowed a homogenous morphology and consequently a much less effect on toughening forits good compatibility with the epoxy network. In addition, it was found that the hydroxylterminated Bisphenol A as a coupling agent gave more improvement in the fracture toughness than the amine-terminated DDS because of effective molecular weight build-up by chainextension reaction. The glass transition temperature (Tg) of modified epoxy resin as measured by dynamic mechanical analysis (DMA)had a lower of Tg in PBA-based PU than that in PTMG-based PU series with the same weight of modifier. |
本系統中英文摘要資訊取自各篇刊載內容。