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題 名 | 刮刀成型法之碳化矽厚薄板生產技術開發研究=Production Technology Development for the Thick and Thin Plates of Silicon Carbide by the Doctor-Blade Method |
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作 者 | 吳玉祥; 詹宜軒; 林博文; | 書刊名 | 中華科技大學學報 |
卷 期 | 62 2015.04[民104.04] |
頁 次 | 頁1-27 |
分類號 | 440.33 |
關鍵詞 | 碳化矽; 刮刀成型法; 陶瓷散熱基板; 燒結; 熱傳導係數; SiC; Doctor-blade method; Ceramic heat sinking substrate; Sintering; Thermal conductivity; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究探討利用刮刀成型法,製備碳化矽(SiC)陶瓷散熱用厚薄板的量產技術,方法是將噴霧造粒過的碳化矽粉末,混合一定比例的分散劑、黏結劑、燒結助劑和溶劑等,製作成相當黏度的漿料。製程先通過投料口,再經由刮刀成型設備的輸送帶,均勻鋪展於佈有離型模的平台上,等待黏結劑揮發後從離型膜取下,形成特定厚薄度且具有光滑面和強度的碳化矽生胚。研究中所使用的碳化矽原料為α相粉體(α-SiC)。材料特性分析方法是使用XRD觀察SiC晶相變化,SEM觀察粉體和生坯表面形貌與造粒後的顆粒大小。將製程中依照不同刮刀法的參數,刮出各種尺寸與厚度碳化矽的厚薄板生胚,乾燥後進行生胚最關鍵的脫酯-燒結製程,發現在500℃、2 hr脫酯條件下,較能夠明顯改善添加劑的凝聚現象,其脫酯的燒失率為17.0 wt.%,分別包括成型時和造粒製程中所添加8.2 wt.%和8.8 wt.%黏結劑,燒失率測量值與TGA(空氣氣氛)分析結果一致。脫酯後的試片以2000℃、1 hr條件進行真空燒結,燒結後的試片再利用熱傳導係數分析儀,測得碳化矽厚薄板熱傳導係數。實驗結果顯示生胚厚度為1.15 mm、長寬50 x 50 mm之碳化矽試片燒結最緻密,燒結密度為2.70 g/cm^3,相對熱傳導係數為73.36 W/m・K,比商業化的低溫共燒(LTCC) 8~15 W/m・K,具備更佳的散熱能力。 |
英文摘要 | This study investigated the mass production for thin and thick films of SiC-ceramic substrate by doctor-blade method. In the beginning of process, sprayed drying SiC powder was mixed with a proportion of dispersant, binder, sintering additive and solvent to form slurry with relative viscosity. In tape casting process, SiC slurry is continuously cast from container and spreading by doctor blade onto the platform of a carrier film by the conveyer belt. The raw green tape at a specified thickness with smooth surface and strength was formed after the binder volatilized and peeled away from the carrier film. The basic ceramic raw material was used with alpha silicon carbide (α-SiC) fine power in this study. The crystalline phase of SiC was analyzed by XRD, in otherwise the powder, surface morphology of green sheet and the particle size after spray granulation were observed in the SEM pictures. Furthermore, the SiC green sheets formed by doctor-blade method according to different sizes and thicknesses are degreased after drying, the most critical is the process of degreasing and sintering the green sheet control. As a result of degreasing study, it was found that the weight loss was 17.0 wt.% at 500℃, 2 hr., among which, 8.2 wt.% was the binder added in doctor blade molding, 8.8 wt.% was the binder of original spray granulated SiC powder. Therefore, subsequent degreasing conditions were set, the agglomeration of additive could be obviously improved. The weight loss was consistent with the TGA result. The degreased sample was sintered in vacuum at 2000℃ for 1hr, and furthermore the thermal conductivity of sintered SiC plates were analyzed by thermal conductivity analyzer. The experimental results showed that the SiC sample in thickness of 1.15 mm and in length and width of 50 x 50 mm was sintered most compactly. The sintered density was 2.70 g/cm^3, and the thermal conductivity was 73.36 W/m.K. It has much better heat dissipating capacity than the commercial 8~15 W/m.K of the low temperature co-fired ceramics (LTCC) substrate. |
本系統中英文摘要資訊取自各篇刊載內容。