頁籤選單縮合
題名 | 利用EBSD分析通孔填充之各階段的電鍍銅微結構:蝴蝶沉積模式=EBSD Analysis on Butterfly Deposition Mode Microstructures of Electrolytic Cu Deposition in the Through Hole (TH) Filling Process |
---|---|
作者 | 陳昶志; 呂名凱; 謝宛蓁; 許令煌; 何政恩; | 書刊名 | 鑛冶 |
卷期 | 58:1=225 2014.03[民103.03] |
頁次 | 頁62-69 |
分類號 | 472.16 |
關鍵詞 | 蝴蝶沉積; 通孔; 電鍍銅; 晶體取向; 電子背向散射繞射; EBSD; Through hole; TH; Electrolytic Cu; Butterfly deposition mode; Orientation; |
語文 | 中文(Chinese) |
中文摘要 | 本研究旨在探討電鍍槽之循環槽液噴流速度對電鍍銅微結構的影響。研究發現改變噴流速度將使通孔(through hole)內電鍍銅沉積模式從狗骨頭(40 l/min)轉為蝴蝶沉積模式(70 l/min)。電鍍銅的沉積過程大致可分三個時期:(1)沉積初期(t=30-40min),電鍍銅係以共構方式沉積;(2)快速沉積期(t=40-55min),孔內形成一類似蝴蝶翅膀的生長形態;(3)沉積末期(t=55-110min),電鍍銅將轉為以面銅方向(RD)進行沉積。電子背向散射繞射(EBSD)分析結果發現,電鍍初期及快速沉積期,銅主要以[111]||TD取向進行沉積。電鍍末期,銅則轉以[111]||RD取向為主。本研究建立蝴蝶沉積模式下(高噴流速度),電鍍銅微結構演變與相關晶體訊息。此一知識將可作為電子工業之金屬化填孔製程再 精進的重要依據。 |
英文摘要 | We investigated the effect of electrolyte circulation flow rate on the electrolytic Cu microstructure in a TH structure using optical microscopy (OM), field-emission scanning electron microscopy (FE-SEM) and electron backscatter diffraction (EBSD). Results showed that the morphology of the Cu fillings in the TH structure changed from a "dogbonding" to a "butterfly" deposition mode when the electrolyte circulation flow rate was increased from 40 l/min to 70 l/min. In the butterfly deposition mode, the Cu TH filling proceeded through three distinct regimes relative to the plating time (t): (1) the conformal deposition regime (t = 30-40 min); (2) fast deposition regime (t = 40-55 min), and (3) final deposition regime (t = 55-110 min). The EBSD analyses showed that the Cu grains were predominantly oriented with [111]||TD (TD: transverse direction) in the conformal and fast deposition regimes; however, the [111]||RD (RD: rolling direction) orientation became dominant in the final deposition regime. A large number of high angle grain boundaries (HAGBs) with strong coincidence site lattices (CSLs) existed at Σ3 (60° rotation at <111>) and Σ9 (38.9° rotation at <101>) in the Cu fillings. The microstructural/crystallographic evolutions of the butterfly and dogbonding deposition modes were compared. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。