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題 名 | Diffusion Bonding of Superplastic 7475 Aluminum Alloy=超塑性7475鋁合金之擴散接合研究 |
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作 者 | 李世昌; 孫如瑩; 邱六合; 楊智富; | 書刊名 | 大同學報 |
卷 期 | 25 1995.11[民84.11] |
頁 次 | 頁369-391+450 |
分類號 | 440.39 |
關鍵詞 | 超塑性7475鋁合金; 擴散接合; |
語 文 | 英文(English) |
中文摘要 | 本研究是針對航太工業材料超塑性7475鋁合金之擴散接合研究,其接合方式主要 包括固相擴散接合和過渡液相擴散接合。其中過渡液相擴散接合方式是以鋅金屬作為中間層 , 而中間層除了用 20 μ m 之鋅箔外,亦有利用 7475 板料表面處理後電渡鋅來達到目的 。其擴散接合條件分別以表面粗糙度( Rm )是 1.85 μ m 和 8.6 μ m,而鋅膜厚分別由 0 到 20 μ m,並在 760、10 �笐援� 10 �笐� torr 之不同真空環境下進行,於 515 ℃或 530 ℃,1MPa、2MPa 和 3MPa 作 0.5 到 6 小時之靜壓接合研究。 而試片表面處理則以鋅 置換方式作前處理以防止母材表面形成緻密之氧化膜阻礙接合, 續以 XRD、 GDOS、SEM 和 OM 來作表面分析。 其中要評估接合件之品質藉由接合面之微觀組織、破斷面分析觀察以及 剪力測試其強度。 實驗結果顯示,祗要選用適當的接合條件和表面處理方式,其接合強度可高達 90 %之母材 強度。 |
英文摘要 | In this study a couple of bonding techniques have been investigated on a superplastic 7475 Al alloy including solid state diffusion bonding (SSDB) and transient liquid phase bonding (TLPB) using a thin foil Zn interlayer or electroplating of zine. The interlayers of pure Zn for TLPB of 20 μ m thickness were obtained by mill rolling process while the Zn interlayers with thickness equal to or less than 10 μ m were obtained by birect electroplating of Zn onto the 7475 Al alloy. Diffusion bonding of 7475 Al alloy speciments were carried out under a variety of bonding parameters including surface roughnesses of 1.85 and 8.6 μ m in Rm scale, degree of vacuum in 760. 10 �笐� and �笐� torr, uniaxial pressures of 1,2 and 3 MPa, bonding times from 0.5 to 6 hours, bonding temperatures of 515 and 530 ℃ and zine interlayer from 0 to 20 μ m in thickness. Characterizations of zine coatings and the chemical species absorbed or formed in the surface layer of 7475 Al alloy specimens were carried out using XRD. GDOS and optical and scanning electron microscopies. The integrities of the bonds were examined using optical and scanning electron microscopies. The bond strengths were evaluated using a single overlap shear test. The results showed that, with proper bonding conditions and surface pre-treatment, successful bonds with lap shear stress (in T6 condition) greater than 90% of that of the parent alloy can be achieved. |
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