頁籤選單縮合
題 名 | IC封裝測試廠之製造執行資訊系統需求分析=A Requirement Analysis Procedure for the Manufacturing Execution Information Systems of IC Packaging and Test Factories |
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作 者 | 李嘉柱; | 書刊名 | 玄奘學報 |
卷 期 | 3 2001.01[民90.01] |
頁 次 | 頁135-152 |
分類號 | 448.552 |
關鍵詞 | 工廠營運管制系統; 在製品追蹤系統; 資訊系統需求分析; Manufacturing execution system; Work-in-process tracking system; Information system requirement analysis; |
語 文 | 中文(Chinese) |
中文摘要 | 『半導體後段』為晶圓製造(Wafer Fabrication)後之產業統稱,一般而言包含了晶圓測試(Circuit Probing,簡稱CP)、IC封裝(IC Packaging)與封裝後測試(Final Testing)三種製程。IC封裝與測試由於生產產品精細且品質管制嚴格,所以其製造執行(Manufacturing Execution,或生產現場)之資訊管理相較於其他產業自有其特殊性與複雜性。而工廠現場製造執行資訊系統(Manufacturing Execution Information System)的核心即為生產作業流程及其作業管制條件設定。然而,在製造執行資訊系統建置之前對使用者作工廠現場現況流程與作業管制之需求分析為一必要步驟。因此,本文以發展生產現場製造執行資訊系統的角度,首先針對半導體後段產業之生產流程與管制條件作一介紹與型態分析;其次,提出一生產流程需求分析之程序(Procedure)作為建置製造執行資訊系統之需求分析(Requirement Analysis)階段依據。 |
英文摘要 | The main process of IC production consists of IC Fabrication, circuit probing (i.e. CP), IC packaging, and IC final test (i.e. FT). The so-called rare-production of IC manufacturing are CP, IC Packaging and FT. The manufacturing execution information (i.e. MEI) is very improtant for the IC packaging and test due to the characteristic of time criticalness in IC products. The collection of the shop-floor MEI is quite complex and variable for the IC packaging and test. The kernel of the MEI system is the configuration of production routings and operational control rules. Therefore, the requirement analysis is required before constructing the MEI system for IC packaging and test. This paper presents a concise procedure for the requirement analysis for the construction of the MEI system for IC packaging and test. Moreover, the shop-floor manufacturing type of the IC packaging and test are classified and analyzed. |
本系統中英文摘要資訊取自各篇刊載內容。