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題 名 | 具對位一間位芳香族聚醯胺-醯亞胺共聚合體之合成=Synthesis of Aromatic Poly (Amide-Imide) Copolymers Containing Para-Meta Structure |
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作 者 | 汪輝雄; 林禎棋; | 書刊名 | 材料科學 |
卷 期 | 31:1 1999.03[民88.03] |
頁 次 | 頁57-70 |
分類號 | 467.4 |
關鍵詞 | 聚醯亞胺; 聚醯胺; 熱穩定性聚合體; Polyimide; Polyamide; Thermostable polymer; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究首先將間苯二胺( MPA )和間苯二氯醯( IPC )反應以名成具間位的聚 醯胺預聚合體,再加入對苯二氯醯( TPC ),以合成具對位 - 間位的芳香族聚醯胺預聚合 體,此再與三種芳香族二酸酐( PMDA、BTDA、DSDA )與過量的 4,4'-- 二苯甲基二異氰酸 鹽( MDI )所合成之聚醯亞胺預聚合體共聚合,合成具對位一間位芳香族聚醯胺 - 醯亞胺 共聚合體。 所合成出之共聚合體其固有黏度在 0.72-1.15dL/g 之間,且在高溫下可溶於各 種極性溶劑中,所 NMP、DMI、DMAC、DMSO 及 DMF 等, 但部份共聚合體則不溶於�p啶,其 溶解性與其化學性有關,共聚合體含亞�撠簼峔蓁�多醯胺基含量者較易溶解。具對位一間位 聚醯胺 - 醯亞胺共聚合體之薄膜抗張強度、 斷裂伸長率以及初始模數則分別為 59 ∼ 102 MPa、3.1 ∼ 5.1% 及 1.52 ∼ 3.59 GPa 之間。 此外,所合成共聚合體之玻璃轉移溫度為 介於 260 ∼ 324 ℃之間, 且在氮氣中的 10% 重量損失溫度在 463 ∼ 580 ℃,而在空氣 中則介於 450 ∼ 555 ℃之間。 經 X-ray 測試結果, 發現在共聚合體中除了 P-6、B-4、 B-6 及 D-6 因具較多聚醯亞胺含量為非結晶外,其餘共聚合體均具有結晶性。 |
英文摘要 | Thermostable poly (amide-imide)s containing para-meta structure were synthesized by reacting polyamide prepolymers containing para-meta structure with various diisocyanateterminated polyimide prepolymers. The polyamide prepolymers were prepared by first reacting m-phenylene diamine and isophthaloyl dichloride to form a polyamide prepolymer with a meta-structure, then the terephthaloyl dichloride was subsequently added to form an aromatic polyamide prepolymer containing para-meta structure. The polymide prepolymers were also prepared by using 4,4'-diphenylmethane disocyanate to react with pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhdride or 3,3',4,-4'- sulfonyldiphthalic anhydride using one-pot method in order to improve their solubility, but without sacrificing thermal and physical properties. From the experimental results, the inherent viscosity of the copolymers are in the range of 0.72∼1.15 dL/g and readily soluble in various hot polar solvents such as Nmethyl-2-Pyrrolidone, dimethylimidazole, N,N-dimethylacetamide, dimethyl sulfoxide and N,N-dimethylformamide, but some of copolymers are not soluble in pyridine. The solubility is related to their chemical structure. Those copolymers with sulfonyl and more content of polyamide structure display good solubility. all the poly (amide-imide)s containing parameta sturcture have glass transition temperature in the range of 260∼324℃, but the melting point are not much varied. The 10% weight loss temperatures exhibit in a range of 463∼580℃ in nitrogen and 450∼555℃ in air. The tensile strength, elontgation at break and initial modulus of these copolymer films fall in the range from 59∼102 Mpa, 3.1∼5.1% and 1.52∼3.59 GPa, respectively. From the X-ray diffraction studies, all specimens other than copolymers of P-6, B-4, B-6 and D-6 with more amount of polyimide content show an amorphous structure, the others display a crystalline morphology. |
本系統中英文摘要資訊取自各篇刊載內容。