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頁籤選單縮合
題名 | Thermal Behavior and Properties of Bismaleimide Containing Naphthalene=含萘雙馬來醯亞胺之熱行為與性質研究 |
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作者 | 黃漢章; 王春山; | 書刊名 | Proceedings of the National Science Council : Part A, Physical Science and Engineering |
卷期 | 22:2 1998.03[民87.03] |
頁次 | 頁178-184 |
分類號 | 460.02 |
關鍵詞 | 萘; 雙馬來酼亞胺; Naphthalene; Bismaleimide; Michael addition; |
語文 | 英文(English) |
中文摘要 | 選用含□及醚鍵結構的雙馬來醯亞胺單體(BMPN),與商業化常用之4,4-雙馬 來醯亞胺-二苯甲炕單體(BMPM),及含□之環氧樹脂(DGEDN),藉由芳香二胺單體(DDM)進 行加成硬化,使其得以延長交聯點間之分子量,降低交聯密度,和單獨BMI更化樹脂比較 ,確可降低彈性模數,改進硬化樹脂之脆性。硬化樹脂中□環的存在,和商業化之樹脂B PM相比,有著較高的玻璃轉移溫度、熱安定性、彈性模數以及較低的吸水性.比較含□之 環氧樹脂亦可得相同之結果。將此含□雙馬來醯亞胺,配合雙胺單體(DDM),以等比例進 行線性加成聚合反應(Michael addition),可得新穎之不定形的Polyaspartimide,此聚 合物可溶於DMF、DMAc、DMSO及NMP等溶劑中。 |
英文摘要 | The curing, characteristics of bismaleimides (2,7-bis(4- maleimidophenoxy)naphthalene; BMPN and 4,4-bismaleimidophenylmethane: BMPM) were investigated using diamine (4,4-diaminodiphenylmethane; DDM) as a chain extender at a 2/1 molar ratio of bismaleimide/DDM through a Michael-type addition. In addition, linear polyaspartimide was prepared by polyaddition of BMPN and DDM at a 1/l molar ratio in m-cresol. The polymer was amorphous and soluble in various organic solvents, such as N-methyl-pyrrolidone (N-NMP), N,N-dimethylacetamide (DMAc), N,N-dimethylformamide (DMF) and dimethyl sulfoxide (DMSO). The thermal behavior and properties of the cured products were investigated by means of thermoaravimetric analyses and dynamic mechanical analyses. At this molar ratio, the properties of BMPN/DDM showed better Tg, thermal decomposition temperature and moisture resistance than did the epoxy derived from 2,7-dihydroxynaphthalene cured using the DDM system (dialycidyl ether of 2,7- dihydroxynaphthalene (DGEDN)/DDM). |
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