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題名 | PMMA壓克力材料兩階段射出成型固液界面結合強度與破裂之研究=On Interfacial Bonding Strength in a Two-Stage Injection Molded PMMA Plastics |
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作者姓名(中文) | 黃登淵; 李輝煌; 黃聖杰; 楊秉茂; | 書刊名 | 高雄科學技術學院學報 |
卷期 | 27 1997.12[民86.12] |
頁次 | 頁113-130 |
分類號 | 467.4 |
關鍵詞 | 製程參數; 兩階段射出成型; 固液界面; 結合強度; 田口式實驗; Process; Parameters; Two-stage injection molding; Bonding strength; Taguchi orthogonal experiments; |
語文 | 中文(Chinese) |
中文摘要 | 本文以實驗方法針對PMMA壓克力材料,探討兩階段射出成型之固液界面的結合強度與破裂受成型條件及成形過程、如頂出的影響。首先用田口式實驗計劃法,分析8項製程參數,取其中效應較大的5項成型條件,包括為熔膠溫度、第二段射出率、第一段保壓、第一段射出率和模溫。進一步實驗分析,發現界面結合強度在240℃的膠溫下有最好的結合強度;但膠溫230℃時的結合強度最低,但若適當調整模溫與射出率,可提升結合強度且高過膠溫220℃者。膠溫與保壓的交互作用很大,膠溫低時須較大的保壓;高熔膠溫度宜用低保壓。一般保壓壓力不得高於最大射出壓力的一半;再者,高保壓容易造成過度充填和產生殘留應力,而於頂出時破裂。第一段與第二段射出率於膠溫23O℃時對結合強度的效應成U形關係,而於其他膠溫時,隨射出率增加,結合強度略為下降。模壁溫度宜控制在55℃左右最佳。 |
英文摘要 | Aiming at PMMA plastic components molded in two stage fashion, this paper presents the results of an experiment to uncover the effects of the process parameters on the bonding strength between the plastics molded in the two stages. A Taguchi orthogonal experiments was carried out to quantify the effects of eight process parameters which consist of melt temperature, injection flow rate profile (three values), hold pressure profile (two values),time of hold pressure, and the mold temperature. Among these parameter, the most significant ones were found to be, in order, melt temperature, second injection flow rate , first hold pressure, first injection flow rate and mold temperature. Further analysis of the data shows that, in terms of melt temperature, the interfacial bonding strength reaches its maximum at 240℃ and minimum at 230℃. By appropriately setting the mold temperature and injection flow rate, the bonding strength for melt temperature at 230℃ can be promoted and even higher than that at 220℃. It also exhibits a strong interaction between the melt temperature and hold pressure: lower melt temperature requires higher hold pressure and higher melt temperature requires lower hold pressure, to maximize the bonding strength. generally, the hold pressure should not be higher than half of the maximum injection pressure. Furthermore, excess high hold pressure is prone to fracture during ejection as a result of high residual stresses. Generally, the bonding strength decreases with increasing injection flow rate except at a melt temperature of 230℃, at which the x-y plot of injection flow rate (x-axis) versus bonding strength (y-axis) forms a U shape. It is suggested that the mold temperature should be controlled at 55℃. |
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