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題 名 | 聚苯乙烯材料兩階段射出成型固液界面結合強度之理論預估與實驗探討=A Theoretical and Experimental Study of Bonding of the Interface Strength between Solid and Melt for Polystyrene in a Sequential Two-Staged Injection Molding Process |
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作 者 | 黃登淵; 李輝煌; 林秋吉; 黃聖杰; | 書刊名 | 技術學刊 |
卷 期 | 14:1 1999.03[民88.03] |
頁 次 | 頁49-54 |
分類號 | 467.4 |
關鍵詞 | 分子鏈自我擴散; 固液界面代表溫度; 鍵結係數; 固液界面強度; 鍵結度; Diffusion; Interface temperature; Bonding parameter; Bonding strength; Degree of bonding; |
語 文 | 中文(Chinese) |
中文摘要 | 因固液界面間之熱傳遞,使得界面之固態側形成一薄層軟化區域,遂得以在界面 間進行分子鏈自我擴散而促使界面結合的理論模式。本文以此理論模式配合實驗方法,企求 建立固液界面的結合強度與製程參數的關係式。實驗方面,針對聚苯乙烯(PS)材料在其它製 程條件固定下,以改變模溫(mold temperature)和熔膠溫度(melt temperature)進行二階段射出 成型實驗,量測拉伸強度,並與單階段(無結合線)射出成型者相比,謂之鍵結度。理論部份, 定義固液界面代表溫度(T*)為膠溫與模溫之平均值。將實驗結果代入導出的理論模型,計算 鍵結係數(C),加以迴歸分析,獲得一實用的經驗公式,可合理預估PS材料於二階段射出成 型過程中固液界面鍵結度隨膠溫與模溫與冷卻時間的關係。本研究提供的公式,對於CAE 電腦模擬兩階段射出成品之撓曲變形甚至破裂的分析,助益很大。 |
英文摘要 | In a sequential two-stage injection molding process, a thin layer of soft material zone exists between the solid and polymer melt interface. The temperature of the soft material zone is between hot polymer melt and cold solid. A high temperature in the soft material zone will initiate diffusion between the solid and liquid materials. Thus, a theoretical model was developed based on diffusion. The temperature of the interface between solid and liquid is defined as the average of the polymer melt temperature and the mold temperature. With the interface temperature and the theoretical model, bonding parameters can be found via regression analysis. Experiments were conducted in a sequential two-staged injection molding to verify the validity of this model with PS material under various mold and injection temperatures. The results showed that the model developed in this paper agrees well with the experiments, and the predicted bonding strength can be useful for CAE analysis of the two-stage injection molding process. |
本系統中英文摘要資訊取自各篇刊載內容。