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題名 | CMP技術之應用與其發展的趨勢=CMP Technological Applications & Developments |
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作者 | 陳麗梅; 楊政儒; | 書刊名 | 觸媒與製程 |
卷期 | 5:4 1997.07[民86.07] |
頁次 | 頁72-76 |
分類號 | 448.57 |
關鍵詞 | 化學機械研磨; CMP; Chemical mechanical polishing; |
語文 | 中文(Chinese) |
英文摘要 | CMP(Chemical Mechanical Polishing)is critical to successfully fabricating highly advanced wafer devices, having gained increasing use as of late. IBM initially developed CMP technology, as announced publicly in the conference of Multilayers Interconnection/1991. Also,CMP technique has become widely applied in wafter technology where its gate width is below 0.35mm. The related modules technique has also gradually reached maturity. |
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