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題 名 | The Application of FMEA and QFD to the Improvement of Packaging Processes for Transistors=運用FMEA與QFD於電晶體封裝製程新產品之開發 |
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作 者 | 李明賢; 葉兆雄; 雷方奕; 郭修瑋; 雷方奕; | 書刊名 | 品質學報 |
卷 期 | 22:5 2015.10[民104.10] |
頁 次 | 頁441-460 |
分類號 | 440.8 |
關鍵詞 | 品質機能展開; 失效模式與效應分析; 顧客抱怨; QFD; PFMEA; Customer complaints; |
語 文 | 英文(English) |
中文摘要 | 本研究的目的是整合品質機能展開(quality function deployment, QFD)及製程失效模式與效應分析(process failure mode and effects analysis, PFMEA)運用於電晶體封裝新產品的開發,顧客的聲音藉由品質機能展開轉換並融入製程,並將顧客抱怨項目與QFD相互比較,PFMEA應用於各個製程的各個加工站,接著PFMEA和QFD依顧客抱怨項目逐一修正。結果,重加工成本每年節省$559,000,000元。因此,整合PFMEA與QFD降低了工程變更的數目和顧客抱怨的數目,同時也提高良率。 |
英文摘要 | This paper integrates Quality Function Deployment (QFD) and Process Failure Mode and Effect Analysis (PFMEA) to improve the performance packaging processes for Transistors. The voices of customers are transferred and merged into the processes by QFD. Customer complaints are collected and compared with QFD. PFMEA is then applied at each station in each process. Finally, PFMEA and QFD are revised in accordance with the customer complaints. As a result, the total saving in rework expenses is $559,000,000 NT dollars per year. In conclusion, the integration of PFMEA with QFD helps engineers decrease the number of engineering changes, reduce the number of customer complaints, and increase yield rate. |
本系統中英文摘要資訊取自各篇刊載內容。