頁籤選單縮合
題名 | 無鉛銲錫在球格陣列構裝應用之挑戰=Challenges for the Application of Lead-Free Solders on Ball Grid Array Packages |
---|---|
作者 | 莊東漢; 張世穎; 鄭明達; 王宣勝; | 書刊名 | 國立臺灣大學工程學刊 |
卷期 | 89 2003.10[民92.10] |
頁次 | 頁101-110 |
專輯 | 「材料」專輯 |
分類號 | 440.34 |
關鍵詞 | 電子構裝; 無鉛銲錫; 球格陣列構裝; 破壞分析; Electronic packaging; Lead-free solders; BGA package; Failure analysis; |
語文 | 中文(Chinese) |
中文摘要 | 電子構裝採用無鉛銲錫為一無可迴避的時代趨勢,本文列舉各種不同成分無鉛銲錫在球格陣列構裝製程所發現破損問題,其中無鉛銲錫包括:Sn-3.5Ag、Sn-0.9Cu、Sn- 58Bi、Sn-51In、Sn-20In-0.8Cu、Sn-20In-2.8Ag、Sn-4Ag- 0.5Cu、Sn-3Ag-0.5Cu、Sn-4Ag-5Cu等合金,歸納之破損實例包括:介金屬脆斷、金脆破損、孔洞形成、板狀Ag3Sn形成、銲墊剝離、殘留鉛造成Sn-Bi接點劣化、疲勞造成延性轉脆破損、銀厚膜溶解破斷以及析出物造成銲錫不潤濕等。 |
英文摘要 | The adoption of Pb-free solders in lieu of Pb solders is an inevitable trend in the electronics industry. This study sums up the failure modes to which the ball grid array packaging process is susceptible when various Pb-free solders, such as Sn-3.5Ag, Sn-0.9Cu, Sn-58Bi, Sn-51In, Sn-20In-0.8Cu, Sn-20In-2.8Ag, Sn-4Ag-0.5Cu, Sn-3Ag- 0.5Cu and Sn-4Ag-5Cu, are employed. Examples of potential failure modes include: intermetallic embrittlement, gold embrittlement, void formation, Ag3Sn plate formation, pad lifting, Sn-Bi joint degradation caused by Pb contamination, fatigue-induced ductile/brittle transition, Ag thick film dissolution, and non-wetting due to precipitation. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。