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題 名 | Chemical Reaction in Solder Joints of Microelectronic Packages=微電子封裝銲點內之化學反應 |
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作 者 | 何政恩; 林彥良; 蔡瑞云; 高振宏; | 書刊名 | Journal of the Chinese Institute of Chemical Engineers |
卷 期 | 34:4 2003.07[民92.07] |
頁 次 | 頁387-391 |
分類號 | 440.2 |
關鍵詞 | 微電子封裝; 銲點; 化學反應; Solder; Surface finish; Reflow; Intermetallic compound; Electronic package; |
語 文 | 英文(English) |
中文摘要 | 本研究探討微電子封裝中,共晶組成的鉛錫銲料和金鎳墊層之界面反應。在本研究中,將迴銲過後的晶片封裝基板在160°C下做熱處理,再利用光學顯微鏡、電子顯微鏡、微電子探測儀和 X光繞射儀來進行觀察和分析。在迴銲後,金層會完全離開界面,並且在整個銲點中形成許多的(Au1-xNix)Sn₄ 顆粒。同時,一層薄的Ni₃Sn₄會在界面上生成。在熱處理幾百個小時之後,銲點中大部分的 (Aul-xNix)Sn₄顆粒會以一(Au0.45Ni0.55)Sn₄連續層的型態在Ni₃Sn₄層上出現。由文獻中 Au-Ni-Sn 三元衡溫相圖,我們可以合理的解釋(Aul-xNix)Sn₄在界面聚集的驅動力為何。此外,Au-Ni-Sn 三元衡溫相圖也指出Ni₃Sn₄可以溶入大量的 Au,但從本實驗的結果指出,Ni₃Sn₄是否會溶入Au與Ni₃Sn₄所在的位置有強烈的關係,而這個現象也可以用 Au-Ni-Sn三元衡溫相圖來解釋。 |
英文摘要 | The metallurgical reaction between the eutectic PbSn solder and the Au/Ni surface finish in advanced microelectronic packages was investigated. In this study, reflowed packages were subjected to aging at 160°C and then analyzed using an optical microscope, scanning electron microscope (SEM), electron probe microanalyzer (EPMA), and X-ray diffractometer (XRD). After reflow, the entire Au layer had left the interface, forming many (Aul-xNix)Sn₄ particles distributed throughout the solder joint. At the same time, a thin layer of Ni₃Sn₄ developed at the interface. After aging for a few hundred hours, most of the (Aul-xNix)Sn4 particles had regrouped phenomenon at the interface as a continuous (Au0.45Ni0.55)Sn₄ layer over the Ni3Sn4 layer. Using the Au-Ni-Sn ternary isotherm, we rationalized the driving force for the regrouping. The Au-Ni-Sn ternary isotherm also showed that Ni₃Sn₄ could dissolve a substantial amount of Au, but the experimental results indicated that the amount of Au in the Ni₃Sn₄ depended strongly on the locations of the Ni₃Sn₄. This observation was also explained by the Au-Ni-Sn ternary isotherm. |
本系統中英文摘要資訊取自各篇刊載內容。