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題 名 | 環路型熱管之發展與現況=The Current Developments of Loop Heat Pipe |
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作 者 | 吳聖俊; | 書刊名 | 金屬工業 |
卷 期 | 36:3 民91.05-06 |
頁 次 | 頁43-49 |
分類號 | 446.6 |
關鍵詞 | 環路型熱管; 金屬粉粒; 燒結; 電子冷卻; 高傳熱能力; Loop heat pipe; Metal powder; Sintering; Electronic cooling; High thermal dissipation ability; |
語 文 | 中文(Chinese) |
中文摘要 | 環路型熱管具有移熱能力、高傳熱距離長、構造簡單、可靠耐用等優點,已被廣泛應用在太空中,如人造衛星的熱控上。環路型熱管有自發啟動無須貯存槽等優點,因而被認為是電子冷卻的明日之星。環路型熱管其性能關鍵的毛細結構是金屬粉粒燒結製作下的產物,因此環路型熱管的研發,包含金屬粉粒之燒結技術,有著實用的必要性。雖然如此國內有關環路型熱管之研究卻相當有限,發展環路型熱管技術,不僅為電子元件的元件散熱提供一有效的解決方案,以此技術所衍生的各種產品其應用範圍更將擴展至如太陽能集熱器、廢熱回收器、熱交換器等方面,如此對相關產業的發展有一定的助益。 |
英文摘要 | The loop heat pipe has the advantages of thermal dissipation ability, long thermal conductive distance, simple configuration, reliability and durability that has been widely applied in the space such as the thermal control in the satellite. The R&D on loop heat pipe focus on thermal control in the satellite abroad, yet the relevant studies on loop heat pipe are quite limited in Taiwan. The loop heat pipe has more advantages including self-prime and no compensation chamber than capillary pumped loop. Therefore the loop heat pipe becomes the superstar in the electronic cooling field. From literature survey, the design and fabrication of evaporator and wick structure significantly affect the performance of loop heat pipe. However this technology is too classified to get so that this study will develop the technology itself. |
本系統中英文摘要資訊取自各篇刊載內容。