頁籤選單縮合
題名 | 電子構裝導電膠隆點製作與材料特性分析=Manufacturing and Characterization of the Anisotropic Electrical Conductive Adhesive Bump |
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作者姓名(中文) | 黃智源; | 書刊名 | 國立高雄海院學報 |
卷期 | 16 2001.12[民90.12] |
頁次 | 頁1-12 |
分類號 | 448.533 |
關鍵詞 | 無電鍍鎳; 擴散障礙層; 導電膠; 熱疲勞; Electroless nickel; Diffusion barrier; Electrical conductive adhesive; Thermal fatigue; |
語文 | 中文(Chinese) |
中文摘要 | 本實驗研究異方向性導電膠之接合製程,採用脈衝水流析鍍法析鍍平坦性無電 鍍鎳隆點,再由導電膠的SEM分析、熱行為分析以及隆點剪力測試,分別決定後 續熱壓接合製程的壓力、溫度及時間,之後探討不同隆點高度對接合阻抗之影響及 導電膠之接合行為,以瞭解導電膠內各種粒子在覆晶接合製程中所扮演的角色。最 後將接合後之試片進行85℃-85RH 恆溫恆濕試驗,探討異方向性導電膠在高溫高濕 環境下之可靠度。 |
英文摘要 | This work investigated the manufacturing process for producing anisotropic electrical conductive adhesive interconnect. The electroless nickel bonding pad was produced with pulse jet electroless nickel process. The bonding and electrical characteristics of the electrical conductive adhesive interconnect were investigated with SEM, thermal analysis, and shearing test. The adhesive interconnect was also tested under 85 ℃ /85RH environment for its reliability. |
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