頁籤選單縮合
| 題 名 | 電子構裝覆晶接合導電膠接合製程及性質研究=The Process and Property of the Flip Chip Bonding with Electrical Conductive Adhesives |
|---|---|
| 作 者 | 黃智源; | 書刊名 | 國立高雄海院學報 |
| 卷 期 | 15 2000.06[民89.06] |
| 頁 次 | 頁51-56 |
| 分類號 | 448.533 |
| 關鍵詞 | 無電鍍鎳; 覆晶接合; 導電膠; 熱疲勞; 網版印刷; Electroless nickel; Flip chip; Anisotropic electrical conductive adhesive; Fatigue; Screen printing; |
| 語 文 | 中文(Chinese) |
| 中文摘要 | 無電鍍鎳磷鍍層在導電膠製程中,必須製作成高厚度、高平整性的隆點,使導電 膠在熱壓過程中,導電顆粒能相互緊密接觸,以提高其導電率。為提高鍍層的平整性,我們 加入一穩定劑,並利用間歇脈衝水流,驅除附著於光阻四周的氫氣,避免氣泡阻礙析鍍。導 電膠的製程溫度低,製程溫度可達 150 ℃,適用於低溫元件構裝。 本實驗已將導電膠藉網印方式,製作於 500 × 500um 的無電鍍鎳墊上,同時也分析導電膠 的熱行為。 |
| 英文摘要 | The electroless Nickel needs to be smooth and have adequate thickness for the manufacturing of electrical conductive adhesive on it. In this present work a pulse effluent stream as well as a stabilizer was introduced to the electroless nickel deposition process. It eliminates the H �� adsorption on photoresist. The electrical conductive adhesive bump was successfully prepared on the electroless nickel bump with the aid of screen printing method. The thermal property of the ECA was analyzed. |
本系統中英文摘要資訊取自各篇刊載內容。