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題名 | Design of Holonic Model for AMHS Control in an IC Packaging Plant=IC封裝廠自動化物料搬運系統控制之全方位模型設計 |
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作者 | 陳凱瀛; | 書刊名 | 臺北科技大學學報 |
卷期 | 34:2 2001.09[民90.09] |
頁次 | 頁189-198 |
分類號 | 448.945 |
關鍵詞 | 全方位製造系統; 裴氏圖; 自動化物料搬運系統; Holonic manufacturing system; Petri Net; Automated material handling system; |
語文 | 英文(English) |
中文摘要 | 未來之製造系統必需能具彈性去面對更多之變異,所以製造系統之控制方法及架構也必需是彈性且能因應外界環境變動而能即時調整。全方位(holonic)之觀念始於1960年代,至目前為止,許多研究均應用其觀念於動態與高度彈性之製造系統之建模及分析,也均獲得不錯之成效。發展全方位製造系統之目的乃是在為製造系統建立分散式之控制架構,而此製造系統是由許多具自主(autonomous)、合作(cooperative)與智慧(intelligent)功能之模組所組成。 本篇論文對於應用全方位之觀念於半導體封裝廠自動化物料搬運系統之控制作一探討。首先對全方位製造系統之特性及功能作介紹;接下來對於半導體封裝廠自動化物料搬運系統内可能之組成元件作一調查與尋找,並分析各組成元件之内容(intra-holon)與元件間(inter-holon)之互動關係,然後以裴氏圖(Petri-Net)這種圖形化工具來描述所分析之結果;最後將對本研究所得之結果與未來研究方向作一討論。 |
英文摘要 | Future manufacturing systems need to cope with frequent changes and disturbances. As such, their control requires constant adaptation and highly flexibility. The "Holonic" concept was proposed in the late 1960s as the basis for modeling highly flexible and dynamic system, and the holonic paradigm for manufacturing system control promises to handle these problem successfully. Its ultimate aim is to develop architecture fro highly distributed manufacturing systems, built from a modular mix of standardized, autonomous, co-operative and intelligent components. This paper gives an overview of the holonic architecture for manufacturing systems. First, the concepts of holonic and its key elements, "holons" are introduced. Second, behaviors of constituted holons inside automated material handling system (AMHS) for an IC packaging plant are investigated. And then, Petri Net mdels are adopted to describe the behavior inside each holon and interactions among holons. Third, the holonic model for AMHS in an automated IC packagingplant is constructed. Finally, some concluding remarks are made to point out the problems for design of holonic model and the future work of applying the holonic model to develop control software. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。