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題 名 | Computer Simulation of Electro-Thermomechanical Interactions of an Oxygen Sensor during Warm-Up=有氧感測器於熱機階段之電-熱-機械性交互作用之電腦模擬 |
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作 者 | 黃德言; | 書刊名 | 中國工程學刊 |
卷 期 | 22:3 1999.05[民88.05] |
頁 次 | 頁315-324 |
分類號 | 471.3 |
關鍵詞 | 電腦模擬; 有氧感測器; 熱傳導; 熱應力; Computer simulation; Oxygen sensor; Heat transfer; Thermal stress; |
語 文 | 英文(English) |
中文摘要 | 本文提出預測有氧感測器於熱機階段之溫度分佈線型及熱應力大小之電腦模擬模 型及分析方法,藉此法評估由不同陶瓷材料所構成之有氧感測器之應用性能,基於分析結果 研判測試件破壞之原因並提出設計改進之構想。本文重心在於應用商用有限元素軟體結合自 行發展之副程式,模擬電-熱-機械性之交互作用;應用複合材料理論來模擬平板型有氧感測 器Al□O□/鉑/Al□O□複合層,以一自行發展之副程式與ABAQUS主程式連結,以模擬熱機 階段之電路反應並計算電阻產生之熱通量,再以另一自行發展之副程式計算平板型有氧感測 器表面之對流熱傳導及輻射熱傳導係數,解得溫度分佈及熱應力大小,最後分析結果並與實 驗值比較,以作合理之評估及改進之建議。 |
英文摘要 | There are three purposes for this study. The first one is to develop a computer simulation model to predict the temperature profiles and the associated thermal stresses of an exhaust oxygen sensor during the warm-up stage. The second is to evaluate the applicability of two kinds of ceramic material, PSZ and TTZ, based on warm-up performance and thermal stress magnitude. And the third is to identify the causes of test failures and propose improvements in design. A finite element model was built, which included a zirconia sensor body, a platinum heater and alumina insulating layers. The area with the embedded heater in the coating was considered a composite plate. A single layer was used to approximate the Al□O□/platinum/Al □O□ layers. A transient heat transfer analysis was performed first to obtain the thermal response of the exhaust oxygen sensor. The analysis simulated the electrical circuit behavior and thermomechanical interactions of a vertically supported oxygen sensor powered by a constant voltage during a warm-up test. In the simulation, the electrical resistance, convective coefficient and radiative emissivity were considered temperature dependent. Using ABAQUS (1994) finite element code, a user subroutine DFLUX was developed to interface with the source code to calculate the electric power density of each heater element. Another user subroutine, FILM, was developed to compute the combined convective and radiative heat transfer coefficient on the sensor surface. With the simulated temperature distributions, a follow-up stress analysis was conducted for the associated thermal stresses. The above procedures were applied to PSZ and TTZ sensors to select the better sensor substrate. |
本系統中英文摘要資訊取自各篇刊載內容。