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題名 | 電子構裝用體積比矽粒子--銅基複合材料之研究=Development of Silicon Reinforced Copper Matrix Composites for Electronic Packaging |
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作者 | 李源發; 李勝隆; 李正國; 黃吉宏; | 書刊名 | 技術學刊 |
卷期 | 15:4 2000.12[民89.12] |
頁次 | 頁673-682 |
分類號 | 440.34 |
關鍵詞 | Cu/Si抅複合材料; 熱壓燒結; 電子構裝材料; Cu/Si抅composite; Hot pressing; Al additive; Electronic packaging; |
語文 | 中文(Chinese) |
中文摘要 | 本研究係以熱壓法製造高體積比矽(Si)粒子—銅基複合材料,開發低熱膨脹、高熱傳道與低密度之電子構裝材料。由實驗結果得知,添加5-10vol.%Al可增強Cu/Si□複合材料之抗彎強度、熱傳導率以及在5%NaCl/pH6.7溶液中之抗腐蝕性。另外,添加Al亦可降低Cu/Si□複合材料之孔隙率及熱膨脹系數。由X-ray繞射與微分掃發熱分析,可發現Al之添加可降低Cu□Si脆性介金屬之生成,產生CuAl□強化相與增強複合材料之抗彎曲強度。 |
英文摘要 | Silicon reinforced copper matrix composites containing 50-80 vol. % Si and 0-10 vol. % Al were fabricated by hot pressing. The results show that the flexural strength, the thermal conductivity and the corrosion resistance in 5% NaCl solutions are promoted when Cu/Si□ composites received an added 5-10 vol. % Al. In addition, the porosity and the coefficient of thermal expansion (CTE) of the Al-containing composites are lower than those of the composites without al. From observing the fracture surface after a flexural test, it seems Al additive can improve the bonding strength of the Cu-Si interface and constrain the cracking of the composite. From the EDX analysis, Al additive also can reduce the intermetallic compound (Cu□-Si) formation in the Cu-Si interface. |
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