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題 名 | The Effect of Palladium on Copper Dispersion and Ethanol Dehydrogenation Activity of Cu/Al[feaf]O[feb0]Catalysts Prepared by the Electroless Plating Procedure=無電鍍法製備銅觸媒過程中鈀對銅分散性及乙醇脫氫活性之研究 |
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作 者 | 林文雄; 張新福; | 書刊名 | Journal of the Chinese Institute of Chemical Engineers |
卷 期 | 30:1 1999.01[民88.01] |
頁 次 | 頁51-57 |
分類號 | 468.8 |
關鍵詞 | 無電鍍銅觸媒; 鈀; 銅; 分散性; 乙醇脫氫; Copper catalyst; Alumina; Electroiess plating; Ethanol dehydrogenation; |
語 文 | 英文(English) |
中文摘要 | 無電鍍銅觸媒在製備中,以鈀為析鍍中心,本研究以γ-Al₂O₃為載體,先行含浸氯化鈀溶液,得到四種鈀含量(0.08-0.33wt%)之先驅物,再以 1200c.c及800c.c.之無電鍍銅鍍液析鍍,製備八種銅含量(5.45~27.27wt %)之觸媒。以定量體積化學吸附方法,分析銅及鈀之分布情形,用CO及H₂量測鈀之分散性,並以N₂O及NH₃分別做銅表面積及觸媒酸度測試,以乙醇進行脫氫反應,得以了解銅觸媒之特性及反應活性。實驗結果得知在特定鍍液中,銅析鍍量隨鈀含量線性上升,顯示分散鈀與無電鍍銅有密切的關係,無電鍍銅之銅表面積在銅含量13.67~15.8wt%時呈現極大值,乙醇脫氫之轉化率隨銅含量增加而稍微變化。無電鍍銅觸媒對乙醇脫氫可能為結構敏感型反應。 |
英文摘要 | In the preparation of electroless copper catalysts, palladium serves as the nucleating center to trigger the chemical deposition. In this study PdCl₂ was impregnated on γ-Al₂O₃ to get four precursors which possessed various palladium loadings(0.08~0.33wt%). Subsequently, two electroless copper plating bath volumes (800cc and 1200cc) were applied to get eight catalysts with different copper loadings (5.45~27.27wt%). The distributions of copper and palladium were analyzed by the volumetric chemisorption method. CO and H₂ were used to measure the dispersion of palladium. N₂O and NH₃ were used to measure the copper surface area and the acidity of catalysts, respectively. Ethanol dehydrogenation was adopted as a model reaction to characterize the activity of electroless copper catalysts. The experimental results showed that copper loadings increased linearly with palladium loadings in a specific plating bath volume, which was indicative of an intimate relationship between the dispersed palladium and the electrolessly-plated copper. The maximums of copper surface areas were observed when copper loadings appeared in the range of 13.67wt% to 15.8wt%. The conversions of ethanol slightly depended upon copper loadings. Ethanol dehydrogenation over electroless plated copper catalysts might be a structure-sensitive reaction. |
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