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題名 | 鈦鋁介金屬紅外線接合及其介面之研究=The Microstructural Evolution of Infrared Joining of Tial Intermatallics using Ti-15Cu-15Ni Foil |
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作者 | 李訓杰; 吳錫侃; 王建義; Lee, S. J.; Wu, S. K.; Wang, J. Y.; |
期刊 | 材料科學 |
出版日期 | 19970600 |
卷期 | 29:2 1997.06[民86.06] |
頁次 | 頁134-139 |
分類號 | 440.39 |
語文 | chi |
關鍵詞 | TiAl介金屬; 紅外線加熱; 硬銲接合; 接合介面組織; 交互擴散; 組成擴散路徑; TiAl intermetallic; Infrared joining; Brazing; Interfacial microstructures; Compositional diffusion paths; |
中文摘要 | 本文以紅外線加熱法為熱源,以Ti-15Cu-15Ni(wt%)為硬銲填料,來從事於Ti-50 Al(at%) 介金屬基材之硬銲接合研究。實驗結果顯示,在快速昇降溫製程中,不需要高真空 即可從事於 TiAl 介金屬之硬銲接合,接合剪應力強度可達 190MPa 以上,且介面中並無氧 化層之存在。整體接合介面組織層狀結構分明,而與接合溫度及保溫時間皆有極密切之關係 ,其主要取決於基材與填料間原子之交互擴散作用與組成擴散路徑;擬三元定溫相圖中擴散 路徑呈現出 "S" 形曲線,每一單相層中組成貫穿曲線具平滑連續性, 而層與層界面處組成 有陡峭之不連續性存在。相對地,冷卻過程對於介面組織之形成,僅具有偏局部性與較輕微 的影響。 |
英文摘要 | Infrated joining of TiAl using Ti-15Cu-15Ni(wt.%) foil as brazing filler metal was investigated at the temperature range of 1100 ℃∼ 1200 ℃ for 30 ∼ 60 seconds in a flowing argon environment. By the sensitive responses of infrared joining, the microstructural evolution of joint interface could be effectively revealed. Experimental results show that TiAl intermetallics can be brazed without high vacuum in the rapid heating process of infrared joining and the joint shear strength is above 190 MPa. All the joint interfaces show different multilayered structures. Both of joining temperature and the holding time greatly affect the microstructural evolution which is mainly depended on the atomic interdiffusion between the base metal and filler metal and on the diffusion path joint interface. The diffusion paths on the Ti-Al-Ni(Cu) pseudo-ternary isotherm show "S" curves. Seven characteristic zones can be distinguished in the joint. The locus of each specifiz zone shows a continuously or smoothly varying interval in the diffusion-path diagram and corresponds to one of the stable phases existing at the joining temperature. These multilayered interfacial structures werc mainly formed by bthe isothermal solidification and the following solid-state interdiffusion during joining. The rapid cooling process of infrared joining only has local and small effects on the microstructural evolution. |
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