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題 名 | 游離磨粒線鋸切削加工參數影響加工特性之研究=Effects of Cutting Parameters on the Performance of Free Abrasive wire Sawing Process |
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作 者 | 廖運炫; 許春耀; | 書刊名 | 國立臺灣大學工程學刊 |
卷 期 | 77 1999.10[民88.10] |
頁 次 | 頁101-112 |
分類號 | 446.893 |
關鍵詞 | 線鋸切削; 田口氏實驗計畫; 材料去除率; 切片表面的粗造度; 磨漿濃度; Wire saw; Taguchi quality design; Material removal rate; Machined surface roughness; Slurry concentration; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究的目的在探討線鋸切削 (wire saw) 中,影響加工特性的加工參 數。文中探討的加工特性包括:材料去除率、切片表面粗糙度 (machined surface roughness of wafer)、切口寬度 (kerf width) 及鋼線磨耗量。加工參數包括:鋼線 張力、磨漿濃度、磨料粒度、鋼線速度和切削負荷。利用田口氏實驗規劃,配合 變異數理論分析,研究結果發現切片的表面粗糙度 (roughness) 在各種不同的加 工條件下,沒有明顯的變差。增加鋼線速度與切削負荷、適度的增加磨漿濃度、 用適當的磨粒尺寸,可以提升材料的去除率。 |
英文摘要 | Effects of cutting parameters on the performance of free abrasive wire sawing process are investigated. The performance discussed in the paper includes machined surface roughness of the wafer, wear of the wire, material removal rate and kerf width. The cutting parameters are wire tension, slurry concentration, grain size, wire speed and working load. Taguchi quality design complies with analysis of variance is employed. The results show that there is no significant difference in the roughness of the machined surface of the wafer irrespective to the cutting conditions. Wire speed and the working load are positively related to material removal rate. It is also found that the use of appropriate grain sizes with moderately increased slurry concentration results in a larger removal rate. |
本系統中英文摘要資訊取自各篇刊載內容。