頁籤選單縮合
題名 | 胺基矽酮橡膠改質環氧樹脂為低應力封裝材之研究 |
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作者姓名(中文) | 謝正悅; 王春山; | 書刊名 | 技術學刊 |
卷期 | 10:1 1995.03[民84.03] |
頁次 | 頁111-117 |
分類號 | 467.41 |
關鍵詞 | 胺基矽酮橡膠; 低應力; 鄰甲酚醛環氧樹脂; Aminosiloxane; Low stress; Cresol-formaldehyde novolac epoxy resin; CNE; |
語文 | 中文(Chinese) |
中文摘要 | 本研究係利用不相溶可撓劑,將胺基矽酮橡膠與環氧樹脂之環氧基架橋,而以極微小顆粒均勻分散於環氧樹脂中,來改質鄰甲酌酚酫環氧樹脂,以改善樹脂之脆性。更進一步探討矽酮橡膠分子量大小對樹脂增韌效果之影響,並將改質環氧樹脂應用於半導體封裝材。透過動態黏性及機械性質之分析結果顯示,微拉分散的矽酮橡膠可有效地降低環氧樹脂之撓曲模數及熱膨脹係數而達到增韌之效果,而玻璃轉移溫度卻只稍微降低。 |
英文摘要 | Amine terminated polydimethyl siloxanes (ATPDMS) were used to reduce the stress of cresol-fonnaldehyde novolac epoxy resin cured with phenolic novolac resin for electronic encapsulation application. The effects of structure and molecular weight of amine terminated polysiloxanes in reducing the stress of encapsulant were investigated. The mechanical and dynamic viscoelastic properties of rubber-modified epoxy networks were also studied. The dispersed silicone rubbers effectively reduce the stree of cured epoxy resins by reducing the coefficient of thennal expansion (CTE) and flexural modulus, while the glass transition temperature (Tg) was hardly depressed. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。