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題名 | The Effect of the Different Anions on the Structure and Hardness of Copper Deposit under Pulse Current Conditions=脈波電流鍍銅之鍍層結構與硬度受不同陰離子影響之研究 |
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作者 | 曾錦興; 萬其超; |
期刊 | Journal of the Chinese Institute of Chemical Engineers |
出版日期 | 19910900 |
卷期 | 22:5 1991.09[民80.09] |
頁次 | 頁277-283 |
分類號 | 468 |
語文 | eng |
關鍵詞 | 脈波; 陰離子; 硬度; 結構; 電流; 鍍銅; 鍍層; |
中文摘要 | 本論文研究在不同脈波電流鍍銅條件下,鍍層之結構及微硬度受不同陰離子(硫酸根、氟硼酸根、過氯酸根、氟離子等)的影響。以脈波電流密度,通電時間和斷電時間作為實驗的變數,所得鍍層之結構與微硬度分別以掃描式電子顯微鏡(SEM)和微硬度測試儀測試之。實驗發現,在相同脈波電鍍條件下,硫酸根離子對鍍層微硬度的影響遠較氟硼酸根及過氯酸根離子為大,含硫酸根離子鍍液所得鍍層之微硬度也較氟離子鍍液者為高。這些可能的原因在文中均有詳細的討論。我們實驗也發現,不同陰離子鍍液對過電壓,鍍層顆粒大小或微硬度間的影響有很密切的關連。 |
英文摘要 | The effect of anions including SO□, BF□, ClO□ and F□ on the surface structure and the microhardness of copper deposits under pulsed current conditions were investigated. The parameters involved the pulsed current density, pulsed-on time and pulsed-off time. The structure and microhardness were examined by scanning electron microscopy and microhardness tester measurement. SO□ions were found to have more marked effect on the microhardness than BF□ or ClO□ ions under the same pulsed plating conditions; possible reasons are discussed. Sulfate bath which produces copper deposits with higher microhardness than that of fluoride bath are also studied. We also found a correlation between the anion effect on the overpotential and on the deposits grain size or microhardness. |
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