頁籤選單縮合
題 名 | Flowing Field Analysis and Experiment of the Electroforming of Micro-Hole Array Mold Insert=不同尺寸微孔洞陣列模仁電鑄流場分析與實作 |
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作 者 | 傅明南; 李慶忠; 葉翳民; | 書刊名 | 中正嶺學報 |
卷 期 | 41:2(A) 2012.11[民101.11] |
頁 次 | 頁21-30 |
分類號 | 472.2 |
關鍵詞 | 陣列模仁; 深寬比; 微電鑄; 流場分佈; Array mold insert; Aspect ratio; Micro-electroforming; Flow field distribution; |
語 文 | 英文(English) |
中文摘要 | 本文針對微孔洞陣列模仁電鑄流場,以計算流體的方法配合電腦軟體建立模型,並針對其中的流場效應及應力分布作深入探討,透過電腦數值模擬可以發現,低深寬比對鍍液交換效果明顯較好,深寬比不高情況下,孔徑距/孔徑比對流場影響有限,可以不受孔徑距/孔徑比之限制。在多孔陣列特性上,鍍槽陰極板轉速過高並無實質幫助,配合尺寸規格不同,以低轉速進行製程,不僅節省成本,且可增進產品品質,並可作為多種用途陣列模仁製程重要之參考依據。 |
英文摘要 | This paper study uses computational fluid simulation to build models for the electroforming flow field of a micro-hole array mold insert, and discusses flow field effects and stress distribution in detail. Simulation results demonstrate that similar aperture sizes with a low aspect ratio improved the plating solution interchange rate. The plating solution interchange rate with large aperture and fast entry flow speed is better. The enhanced rotational speed of the cathode can increase the upward flush speed for a small hole. Via centrifugal force, it specify can increase the carrying speed of an old plating solution for a small hole and low entry flow speed. In the characteristics of a multi-hole array, an overly high rotation rate for the cathode plate in a plating tank does not substantially assist. Using a low rotation rate to carry out during process with different sizes and specifications, reduces cost, and increases production quality. This can be regarded as an important reference for multi-usage of micro-hole array mold insert design and production. |
本系統中英文摘要資訊取自各篇刊載內容。