頁籤選單縮合
題 名 | 矽氧含量對水性聚胺基甲酸酯樹脂性質之影響=Effects of Silica Content on the Properties of Waterborne Polyurethane Resins |
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作 者 | 李雲蕓; 林瑋姝; 李文昭; | 書刊名 | 林產工業 |
卷 期 | 34:1 2015.03[民104.03] |
頁 次 | 頁35-44 |
分類號 | 467.4 |
關鍵詞 | 有機-無機混成材料; 樹脂薄膜; 矽氧高分子; 四乙基矽氧烷; 水性聚胺基甲酸酯樹脂; Organic-inorganic hybrids; Resin films; Silica polymer; Tetraethoxysilane; Waterborne polyurethane resins; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究利用聚四甲基醚二醇(Polytetramethylene ether glycol;PTMG)及異佛爾酮二異氰酸酯(Isophorone diisocyanate;IPDI)為原料,二羥甲基丙酸(Dimethylolpropionic acid;DMPA)為乳化劑,三乙胺(Triethylamine;TEA)為中和劑,乙二胺(Ethylenediamine;EDA)為鏈延長劑合成水性聚胺基甲酸酯樹脂(Waterborne polyurethaneresins;WPU)。以四乙基矽氧烷(Tetraethox ysilane;TEOS)為無機矽氧高分子之前驅化合物,設定矽氧含量為WPU樹脂乾重1%、3%及5%。將WPU與不同設定量TEOS混合密封,探討經儲存30天後樹脂液之性質變化及所製作WPU薄膜之性質。由結果得知,經30天後WPU樹脂液之黏度及表面張力均提高。FTIR及^(29)Si-NMR分析顯示所製作WPU薄膜中具備矽氧結構。拉伸試驗顯示含矽氧結構之WPU薄膜之拉伸強度降低,破壞伸長率則增加。DSC分析顯示,隨矽氧含量增加,WPU薄膜之熱活動性提高。DMA分析則顯示隨矽氧含量增加,其高溫側阻尼值波峰之起始溫度及最高峰溫度降低,但WPU薄膜之剛性則提高。TGA分析顯示不同矽氧含量WPU薄膜有相似之熱裂解行為,但矽氧含量較高者有較佳之熱抵抗性。 |
英文摘要 | In this study, waterborne polyurethane resin (WPU) was prepared with polytetramethylene ether glycol (PTMG) and isophorone diisocyanate (IPDI) as raw materials, dimethylolpropionic acid (DMPA) as the emulsifier, triethylamine (TEA) as the neutralizer, and ethylenediamine (EDA) as the chain extender. The tetraethoxysilane (TEOS) was used as a precursor compound to prepare the organic-inorganic hybrids containing silica polymer. The weight ratio of silica to the dry weight of WPU was set at 1%, 3%, and 5%. The mixtures containing WPU and calculated amount of TEOS were sealed and stored for 30 days. After that, the variation in characteristics of resin solution and the properties of WPU films prepared were investigated. The experimental results showed that the viscosity and surface tension of WPU solution increased after 30 days of storage. FTIR and 29Si NMR analysis showed that the silica structure appeared in the WPU films. Tensile test indicated that the tensile strength of WPU film containing silica decreased, but the fracture elongation increased. DSC analysis showed that the heat activity of WPU films increased with the increasing of silica content increased. DMA showed that with the silica content increased, the onset temperature and peak temperature of damping peak at high-temperature side decreased. However, the stiffness of WPU films increased. TGA showed that WPU films with different silica contents had a similar thermal degradation behavior, while the higher silica content provided the films with better heat resistance. |
本系統中英文摘要資訊取自各篇刊載內容。