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題 名 | 與骨整合相關的骨頭-植體交界面的初期傷口癒合(Ⅲ)骨頭-植體交界面癒合的動力學與進行機制=Early Wound Healing at Bone-Implant Interface Related to Osseointegration. Part (Ⅲ) The Kinetions and Acting Mechanisms of Bone-Implant Interface |
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作 者 | 何政昇; | 書刊名 | 臺灣牙周病醫學會雜誌 |
卷 期 | 17:2 2012.06[民101.06] |
頁 次 | 頁169-182 |
分類號 | 416.96 |
關鍵詞 | 交界面; 骨癒合; 植體-骨頭癒合機制; Interface; Intrabony healing; Bone-implant healing kinetics; |
語 文 | 中文(Chinese) |
中文摘要 | 隨著電子顯微鏡的出現,骨整合的詮釋由光學顯微觀察下所謂的在骨頭與植體之間存在著功能與結構的直接接觸(direct contact)的概念,到在骨頭與植體之間的交界面仍存在著一些amorphous layer,包括proteoglycan及混合一些immature fiber與filament。這凸顯出一個事實:即使被公認親和性相當高的鈦合金,對緊緊相鄰的骨頭而言,也會產生某種程度的異物排斥反應。在本文的第三部份,將由in vitro/in vivo的研究角度,以細胞層面的證據來細部探究骨頭-植體交界面癒合程序的機轉建立。是否骨內傷口的癒合模式與植體周圍的骨頭癒合模式有所差別,在文中將有進一步的探討。此外,植體在植入骨頭前與一旦植入骨頭後的表面反應與植體表面處理的互動影響也會充分探討。透徹了解骨頭-植體交界面的癒合程序,臨床醫師對於維持長期成功的植體治療將會有進一步的掌握與信心。 |
英文摘要 | With the emerging development of electron microscope, the disclosure of osseointegration was upgraded from the level of micrometer to the level of nanometer for clinicians. The definition of osseointegration was also switched from the concept of direct functional and structural connection between bone and implant to the findings described as an amorphous interfacial layer with proteoglycans, infiltrated immature filaments and fibers under the observations of electron microscopy. It reveals a fact that there still seems to have some kind of foreign body rejection when bone was next to the highly compatible titanium alloy implant. In the third part of this review, the healing kinetics between bone and implant interface will be explored from the cellular levels of evidences contributed from in vitro and in vivo studies. Whether the healing patterns/signs between intra-bony wound and peri-implant wound are alike will be explored further. Besides, the changes on implant surface related to surface treatment prior to implant placement and after implant placement will also be discussed. It helps for clinicians manage the success of long-term functional implant with osseointcgration at the interface under the fully undertanding of the healing procedure at the bone-implant interface. |
本系統中英文摘要資訊取自各篇刊載內容。