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題 名 | 軟膜捲帶之高精度傳輸定位技術探討=Discussion on Film Tape High-Precision Transfer Positioning Technology |
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作 者 | 李昌周; 柯志諭; 劉錦龍; 李松賢; 林育信; 許志豪; | 書刊名 | 機械技師學刊 |
卷 期 | 6:4=24 2013.12[民102.12] |
頁 次 | 頁9-14 |
分類號 | 448.57 |
關鍵詞 | 捲帶式薄膜覆晶封裝; 捲帶式晶片載體封裝; 內引腳接合; 外引腳貼合; 捲繞傳輸; 軟膜捲帶; 衝切; Chip on film; COF; Tape carrier package; TCP; Inner lead bonding; ILB; Outer lead bonding; OLB; Roll to roll; R2R; Reel; Punch; |
語 文 | 中文(Chinese) |
中文摘要 | 軟膜捲帶為應用在驅動晶片生產過程的主要輸送方式,因應電子產品導線技術日趨嚴苛,高精度傳輸定位已成為設備發展之重要環節。本文針對驅動晶片封裝技術加以比較,並以捲帶式薄膜覆晶封裝之外引腳貼合為基礎,探討軟膜捲帶之高精度傳輸定位所面臨的問題,最後再提出適當解決方案。 |
英文摘要 | Film tape transport is main method applied to the drive IC production process. As electronic products become more and more demanding in specification, the transfer positioning accuracy of the device IC production has become an important technology. Firstly, the main driver IC packaging technologies compared. Then, review the tape transfer and positioning problems in high-precision outer lead bonding. Finally, propose appropriate solutions. |
本系統中英文摘要資訊取自各篇刊載內容。