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題 名 | 發展化學機械研磨製程之二維原子有限元素模式模擬圓形刀鼻鑽石研磨粒之切削行為=Developing a Two-Dimensional Atomistic FE Model to Study the Cutting Behavior of a Round-Nose Diamond Particle in CMP Process |
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作 者 | 林有鎰; 邱進東; 羅仕鵬; | 書刊名 | 德霖學報 |
卷 期 | 26 2013.04[民102.04] |
頁 次 | 頁49-58 |
分類號 | 446.893 |
關鍵詞 | 化學機械研磨製程; 銅工件; 圓形刀鼻鑽石研磨粒; 二維原子有限元素模式; CMP; Copper workpiece; Round-nose diamond particle; Two-dimensional atomistic finite element model; |
語 文 | 中文(Chinese) |
中文摘要 | 本文考慮在研磨過程中,切屑厚度比研磨粒小很多,又在相當小的進給尺度下,將研磨粒視為直線作用於銅工件上而建立了包含非線性彈簧及阻尼元素的二維原子有限元素模式。模擬過程為將圓形刀鼻鑽石研磨粒固定在研磨墊上,下壓至固定深度(=3.7 0A),再以300m s的速度橫移進行含銅金屬層晶圓(銅金屬層,稱為銅工件)的研磨切削,來移除銅工件原子,藉此探討二維鑽石研磨粒形狀的影響。結果顯示鑽石研磨粒和銅工件一開始並無接觸,因此切削力和下壓力皆為零;當鑽石研磨粒逐步下壓,切削力和下壓力逐步增加;而當研磨粒開始以300m s的速度橫移產生研磨切削行為,切削力和下壓力隨著時間的經過,逐漸增加;當切削過程即將結束時,切削力和下壓力逐漸減少。 |
英文摘要 | In this paper, during the grinding process in CMP, the chip thickness is less than an abrasive particle, and the particle can be regarded to act on the copper workpiece linearly because of a significant small feed, a two-dimensional atomic finite element model with nonlinear spring-damping elements was established to investigate the cutting behavior of a round-nose diamond particle under the condition that it is fixed on the pad to polish the wafer possessed a copper metal layer (i.e. copper workpiece). The results showed that at the beginning, the diamond particle doesn’t contact with the copper workpiece, therefore, both the cutting force and down-pressed force are zero. When the particle moves horizontally with a speed of 300m s , the forces increase gradually with time. The forces gradually decrease while the cutting process is finished. |
本系統中英文摘要資訊取自各篇刊載內容。