查詢結果分析
相關文獻
- 添加Ti元素對無鉛銲錫Sn3.5Ag0.5Cu合金顯微組織及微硬度之影響
- 生醫用鈦合金之顯微組織及機械性質研究
- 再加熱處理對軟氮化處理鋼的顯微組織及微硬度的影響
- Ti-Nb二元合金之成份/顯微組織與機械性質之間的關係
- 電腦模擬在鈦合金四面精鍛製程設計之應用
- Hydrophobic Effect of PTFE-Modified Ru矴Ti盁O[feaf]Electrodes on Oxygen Evolution in Alkaline Solution
- Determination of Rate Constants of the Reaction between Titanium Pellet and Nitrogen
- 防曬劑中超微細固態氧化物添加劑其光化學反應機制對防曬功能利弊之探討
- 四氯化鈦在異丙基碳酸酯、異丙醇中電合成鈦金屬粉末
- 物理蒸鍍單層及複層氮化鈦中碳鋼之拉伸及疲勞性質
頁籤選單縮合
題名 | 添加Ti元素對無鉛銲錫Sn3.5Ag0.5Cu合金顯微組織及微硬度之影響=Effect of Ti Element Addition on the Microstructure and Microhardness of Lead-free Sn3.5Ag0.5Cu Alloy |
---|---|
作者姓名(中文) | 朱中平; 曹龍泉; | 書刊名 | 鑄造工程學刊 |
卷期 | 37:2=149 2011.06[民100.06] |
頁次 | 頁29-34 |
分類號 | 472.2 |
關鍵詞 | 鈦; 顯微組織; 微硬度; Sn3.5Ag0.5Cu; Ti; Microstructure; Microhardness; |
語文 | 中文(Chinese) |
中文摘要 | 本研究是針對添加微量鈦(Ti)於無鉛銲錫Sn35Ag0.5Cu合之微觀結構與微硬度的影響。結果顯示,添加微量Ti於無鉛銲錫Sn3.5Ag0.5Cu合金內能達到細化初晶β-Sn、抑制Ag3Sn相的粗大化,以及增加共晶組織面積率。相較於Sn3.5Ag0.5Cu合金,添加Ti於Sn3.5Ag0.5Cu-XTi合金能提高微硬度約8.3至19.6%,此影響效果相當符合Hall-Petch關係式。 |
英文摘要 | Effects of minor Ti additives on the microstructure and microhardness of Sn3.5Ag0.5Ci alloys were investigated in this study. Results indicate that the addition of Ti into the Sn3.5Ag0.5Cu alloy refined the size of β-Sn grains, restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) and extended volume fraction of eutectic area. The addition of Ti could enhance the microhardness of Sn3.5Ag0.5CU-xTi solder by 18.4% compared with the Sn3.5Ag0.5Cu solder matrix. The microhardness of the obtained the Sn3.5Ag0.5Cu-XTi solder alloys fits well with the Hall-Petch relationship. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。