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題 名 | 利用無鉛無助銲劑金錫銲料構裝雷射晶粒經老化之介面微構造及應力研究=The Study of Interface Microstructures and Stresses in Lead-free and Fluxless AuSn Solders for Packaging Laser Diode Chips |
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作 者 | 沈茂田; 董洪巧; 宋正熙; | 書刊名 | 永達學報 |
卷 期 | 7:2 民95.12 |
頁 次 | 頁1-9 |
分類號 | 448.59 |
關鍵詞 | 半導體雷射構裝; 金錫銲料; 介面微構造; Semiconductor laser packaging; AuSn solders; Interface microstructure; |
語 文 | 中文(Chinese) |
中文摘要 | 本文探討無鉛無助銲劑錫金銲料構裝雷射晶粒經老化之推力與介面微構造,雷射晶粒為InP材料,次載具為矽並鍍金,銲料則為無鉛無助銲劑之錫金(AuSn)。改變晶粒黏著機之參數,如銲接溫度、銲接壓力、時間等因素,找出最佳銲接參數使得接合強度能夠提升。將構裝試片置於高溫150℃老化爐內進行0、1、4、9、16、25、36、49、64天之老化實驗,再觀察其剪向推力與介面微結構之變化。實驗結果0天之推力為195g,而64天之推力為125g,根據美國陸軍規範"MIL-STD-883E METHOD 2019.7",對應其雷射面積,合理推力值應為93g。介面微結構觀察結果,發現隨著老化時間的增加,孔洞會成長,裂痕會擴張,甚至界金屬化合物(IMC)的出現,這些因素都直接影響了接合強度。最後,經老化測試方面,我們也成功完成銲接1550nm之半導體雷射,並且能正常工作。 |
英文摘要 | The joint strength and microsturcture for fluxless AuSn solders in packaging of InP substrate onto Si submount after thermal-aging testing were studied experimentally. Specimens were aged at 150°C for up to 64 days. The joint strength decreased as aging time increased. Under the 64days aging, the bonding strength of AuSn solders decreased from 195g to 125g. This matches to the "MIL-STD-METHOD 2019.7" which is the minimum bonding strength of 93g. The microstructure of the AuSn solders joint showed that the joint strength decrease was caused by the enlargement of the initial voids and an increase in the thickness of intermetallic compound (MC). The effect of thermal aging testing on the power variation of 1550nm laser chips using fluxless AuSn solders in laser diode packages was also studied. |
本系統中英文摘要資訊取自各篇刊載內容。