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題 名 | 鎳顆粒與液態錫系銲料界面反應的動力學研究=The Study of Kinetics of the Interfacial Reaction between Liquid Sn-based Eutectic Solders and Ni Particles |
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作 者 | 林忠永; | 書刊名 | 親民學報 |
卷 期 | 12 民95.07 |
頁 次 | 頁167-172 |
分類號 | 472.14 |
關鍵詞 | 非反應性添加合金元素; 複合銲料; 介金屬; Non-reactive additional alloying element; Composite solder; Intermetallic compound; |
語 文 | 中文(Chinese) |
中文摘要 | 本文主要在探討,100Sn、Sn3.5Ag、Sn37Pb及Sn58Bi等二元錫系銲料分別與鎳球在250℃中進行反應形成複合銲料的動力學,反應時間可至100分鐘,結果顯示介金屬的成份為Ni₃Sn₄。非反應性添加合金元素 如Ag, Bi在界面反應不會與Ni參與反應。錫擴散通過介金屬是速率決定步驟,基於此反應機構及似穩態假設,導出球形鎳與銲料反應的動力學方程式,量化錫濃度及非反應性添加合金元素的影響。計算出Sn、Sn-Ag、Sn-Pb Sn-Bi的kD為2.0*10¯[fee4]~1.5*10¯[fee4] m/s²,變化不大,由此顯示添加非反應性合金元素於錫銲料主要影響為降低銲料中錫的濃度。 |
英文摘要 | The kinetics of pure Sn, eutectic Sn-Ag, Sn-Pb, and Bi-Sn solders reacting with Ni particles which form the composite solders at 250°C were studied. A reaction time up to 100min was used. Only the intermetallic compound (IMC) Ni₃Sn₄ was detected as the reaction product. The non-reactive additional alloying elements, such as Ag, Pb, and Bi, do not play an active role in the interfacial reactions. It is the rate-controlling step that the Sn atoms diffuse through the IMC. Based on this reaction mechanism and pseudo-steady state assumption, kinetic equation in which both Sn concentration and non-reactive additional alloying elements effects were quantified was derived and verified by comparing the kinetics of four different alloys with different Sn concentrations and alloying elements. The diffusion coefficients for pure Sn, and eutectic Sn-Ag, Sn-Pb and Sn-Bi solder reacting with Ni particles are in the range of 2.0*10[8ec5]~1.5*10[8ec5]m²/s which shows slight variation in diffusion coefficients. This implied that the alloying elements introduced in the Sn-based solders mainly result in the decreasing Sn concentration in solder. |
本系統中英文摘要資訊取自各篇刊載內容。