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題 名 | 晶圓測試廠產能規劃研究=Capacity Planning for Wafer Probe Plant |
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作 者 | 陳建良; 蕭俊彥; 孫正儒; 呂春美; | 書刊名 | 中原學報 |
卷 期 | 33:3 民94.09 |
頁 次 | 頁495-511 |
分類號 | 448.57 |
關鍵詞 | 積體電路製造; 晶圓測試; 產能規劃; 無限產能; IC manufacturing; Wafer probe; Capacity planning; Infinite capacity; |
語 文 | 中文(Chinese) |
中文摘要 | 積體電路製造包括四大主製程:晶圓生產、晶圓測試、積體電路封裝與成品測試,本研究針對晶圓測試廠提出一套無限產能規劃系統。本系統可分為四個模組:(1)在製品指派模組、(2)批量投料模組、(3)產能堆疊模組、(4)產能平衡模組。在製品指派模組首先收集在製品之資訊,依產品之週期時間預估測試批於各加工站開工及完工時間。當在製品之數量能滿足主生產排程所設定之需求時,則使用在製品來滿足需求。反之,若無法滿足時則使用批量投料模組進行投料。測試批之開工及完工時間計算完成後,利用產能堆疊模組堆疊機臺與治具於各日之產能。若生產資源每日產能堆疊狀況在可接受的範圍內則可依此劇本進行生產。若生產資源每日產能堆疊狀況不盡理想時,可使用產能平衡模組來修改測試批之開工時間,以平衡生產資源之產能。 本研究以Visual Basic發展產能規劃軟體的雛型,並根據實際之晶圓測試廠資料加以驗証本產能規劃系統。藉由實驗設計檢驗產能規劃系統之績效,實驗的結果顯示所發展之產能規劃系統可有效平衡機臺與治具負荷不均的現象。 |
英文摘要 | The manufacturing of integrated circuit (IC) in-cludes four major phases: wafer fabrication, wafer probe, IC packaging, and final test. In this study, an infinite capacity planning system is proposed for wafer probe plants. Four modules are developed: the WIP-Pulling Module, Lot Release Module, Workload accumulation Module, and the Workload Balance Module. The WIP-Pulling Module is used to calculate lot start time and finish time to meet master production schedule (MPS), using WIP information such as the current operation station and batch size. When the WIP quantity is insufficient, the Lot Release Module is called. After calculating the lot start time and finish time, the Workload Accumulation Module is employed to accumulate the everyday workload of ma-chine and jig. If the workload of machine and jig are unbalanced, the Workload Balance Module is exploited to balance these manufacturing resources. A prototype capacity planning software is developed using Microsoft Visual Basic and industrial data are used to test the performance of the capacity planning system. Based on the design of experiments, simulation results show that the capacity planning system is effective and efficient to balance the workload of manufacturing resources including machine and jig. |
本系統中英文摘要資訊取自各篇刊載內容。