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題 名 | 含鉛與無鉛錫球在FCOB封裝體上之熱-機械行為的比較=Comparison of Thermo-mechanical Behaviors on FCOB Packages with Lead and Lead-free Solder Bumps |
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作 者 | 鍾文仁; 邱建嘉; 蔡新春; | 書刊名 | 中原學報 |
卷 期 | 33:3 民94.09 |
頁 次 | 頁449-458 |
專 輯 | 機械工程 |
分類號 | 448.57 |
關鍵詞 | 熱-機械行為; 無鉛材料; 遲滯迴圈; Thermal-mechanical behaviors; Lead-free; Hysteresis loops; |
語 文 | 中文(Chinese) |
中文摘要 | 本文利用有限元素分析-ANSYS探討FCOB封裝體內無鉛錫球96.5 Sn/3.5Ag在底部充填後的熱-機械行為,以典型的-55~125℃溫度循環負載之間間-溫度相關的非線性分析,並模擬錫球與潛變行為。文中以63Sn/37Pb錫球為基準,並皆遵守Garofalo-arrhenius穩態潛變本質方程式,探討最外且貼近晶片端錫球之應力、性與潛應變遲滯迴圈、應力歷史及塑性與潛應變歷史;又無鉛錫球96.5 Sn/3.5Ag具有較高的熔點,其在回銲製程需經過較高的回銲溫,因此在較高-55~125℃溫度循環負載下,分析結果顯示,無鉛錫球96.5 Sn/3.5Ag仍然有較佳之防止潛變效果。 |
英文摘要 | The finite element analysis code-ANSYS was employed to probe then thermal-mechanical behaviors of lead free solder 96.5 Sn/3.5Ag in FCOB after underfill processing in this study. The temperature range of -55~125℃, time-dependent and nonlinear material properties were considered in this analysis to simulate the plasticity and creep behaviors of solders. The lead solder of 63Sn/37Pb is also considered to establish a baseline. All of these solder alloys are assumed to obey the Garofalo-Arrhenius steady-state creep constitutive law. The equivalent stress, equivalent stress history, and equivalent creep strain history at the outmost and farthest solder and near the chip are studied for the flip-chip packages. Moreover, since the lead free material 96.5 Sn/3.5Ag has the higher melting point than 63Sn/37Pb, it needs higher reflow temperature during reflow process. For higher cycling temperature with loading rang -55~125℃, the lead-free solder 96.5 Sn/3.5Ag still has good performance on creep. |
本系統中英文摘要資訊取自各篇刊載內容。