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題 名 | 微液滴導線圖案自組成方法=Method and Apparatus for Microdispensing Patterned Wire with Self Assembly |
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作 者 | 楊明桓; 邱琬雯; 鄭兆凱; 黃介一; 張惠珍; | 書刊名 | 光學工程 |
卷 期 | 88 2004.12[民93.12] |
頁 次 | 頁31-39 |
分類號 | 477.6 |
關鍵詞 | 噴墨; 自組裝; 選擇性; Ink jet; Self-assembly; Selectivity; |
語 文 | 中文(Chinese) |
中文摘要 | 本篇文章描述利用噴印及個組裝等無光罩方式氣備成金屬薄膜;利用自組裝薄膜改變表面性質的方法改善了所噴印的催化濟於機版上的附著力。此導線圖案的製程方法只要包含有3個部分,其一為基板上自組裝薄膜的形成,其次為於基板上噴印峰化濟的過程,最後為化鍍生成銅導線的製程。此製程銅導線厚生成速率為0.1μm/min,其阻值在線為250μm厚度為17μm下約為0.304Ω/cm,這阻值大約是銅塊的8倍(pbulk, cu=1.67μΩ.cm)。為了證實此方法的可行性,我們成功地利用此製程製作一個8051單晶片(12MHz clocks)計算器.此外,鄉們將試片以IPC6013標準測試加以檢測,其結果通過了熱循環境試(288℃,6次)、熱油測試(260℃,3次)、附著力測試及電性測試。 |
英文摘要 | This article describes the growth and characterization of mask-free thin metal films produced by ink-jet printing with self-assembly techniques. Making use of this method, the self-assembled monolayer changes the surface properties of the substrate and improves that adhesion of ink-jet catalyst on the substrate. The patterned molecular self-assembly layers on substrate, a step of micro-disposing catalyst on the said self-assembly, and a step of forming copper conducting wire by electroless plating. The average metal thickness growth rate is about 0.1μm/min. The resistance of metal film is typically about 0.304Ω./cm, at the line width 250μm and line thickness 17μm. It nears eight times of bulk receptivity of copper (pbulk, cu=1.67μΩ.cm). This study also demonstrates an ink-jet printing circuit for 8051 single chip (12MHz clocks) application, and it functions as a LED input/output satisfactory. Following the IPC 6013 standard, the results indicated that after thermal cycle (288℃, 6 times) and hot oil test (260℃, 3 times), the metal circuit kept good adhesion and electric characteristics. |
本系統中英文摘要資訊取自各篇刊載內容。