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頁籤選單縮合
題 名 | 矽晶圓製程簡介及其未來發展 |
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作 者 | 蕭薀華; 高淑文; 余貴坤; | 書刊名 | 萬能學報 |
卷 期 | 25 2003.08[民92.08] |
頁 次 | 頁247-253 |
分類號 | 448.57 |
關鍵詞 | 矽晶圓材料; 製程; 積體電路; |
語 文 | 中文(Chinese) |
英文摘要 | $aMaterials are the basements of culture development of human being; the best important material in 20 and 21 century is "Silicon", which one builds up the semiconductor industry by "Silicon wafer", and "Silicon wafer" is the beginning of all IC to VLSI. Currently all of the semiconductor manufactories focus on efficient semiconductor production processes which kind of processes for semiconductor devices have become more expensive, so they require wafers of larger diameter and more stringent technical specifications in order to produce increasingly complex semiconductor devices such as the larger megabit memory chips and microprocessors. All of the semiconductor manufactories make many semiconductor devices, or chips, from the same wafer, and all chips from a particular wafer are manufactured and processed simultaneously at each stage in the device manufacturing process. Because of this, this article would mention the process of "Silicon wafer" which is the beginning material of semiconductor industry. |
本系統中英文摘要資訊取自各篇刊載內容。