查詢結果分析
相關文獻
- 電腦CPU散熱器熱傳面積與流場對散熱效果影響之研究
- In Vitro Assessment of the Flow Fields in a Three-Dimensional Pulmonary Artery Model with Varying Degrees of Valvular Stenosis
- Finite Volume Calculations of Three-Dimensional Compressible Flows
- 從IDF來看微處理器的未來進展
- 外裝型凸緣氣罩的流場與粒子軌跡模擬
- A Numerical Study of Currents in the Taiwan Strait during Winter
- The Study of Pulsed Au-Plating Deposited Heat Spreader for Semiconductor Lasers
- The Potential Flow Field Generated by the Flanged Hood Openings of Various Shapes
- Phase-Resolved Investigation of Vortex Shedding in Flow Past a Circular Cylinder by Using Laser Doppler Anemometry
- Preliminary Studies of Bubble Wake Dynamics Using Particle Image Analyzer
頁籤選單縮合
題 名 | 電腦CPU散熱器熱傳面積與流場對散熱效果影響之研究=The Effect of Heat Transfer Area and Flow Field for Heat Sink of CPU |
---|---|
作 者 | 李志良; | 書刊名 | 德霖學報. 理工類 |
卷 期 | 16 2002.06[民91.06] |
頁 次 | 頁198-206 |
分類號 | 471.67 |
關鍵詞 | 微處理器; 散熱器; 熱傳面積; 流場; Heat sink; CPU; Heat transfer area; Flow field; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究針對超微公司(AMD)個人電腦微處理器(K7 CPU)之散熱器進行熱性能分析。其中對於CPU散熱器開槽所影響的總熱傳面積與空氣流場加以探討,以設計出最佳之散熱器。本研究以一裝置有熱電偶及溫度顯示器的恆溫箱,進行實驗量測微處理器與散熱器的表面溫度。針對三種不同開槽數量與位置的散熱器實驗量測後,結果顯示中央開槽的散熱器可以減少渦流的形成,同時可增加強迫對流的熱傳效果以增強散熱器的熱傳性能。其中具有最大的總熱傳面積並不能保證能得到最好的散熱效果,而較佳的空氣流場則是能增強散熱器的熱性能,且本研究下一步將以數值模擬套裝軟體進行驗證之工作。 |
英文摘要 | The present study focused on the thermal performance of a heat sink assembly in personal computer for the AMD K7 CPU. The purpose of this study is to investigate the heat transfer area and flow field around heat sink due to the grooves effect for designing an optimum heat sink assembly. An experiment was performed in a temperature chamber to measure the temperature of CPU by thermocouples and acquisition unit. For three types of heat sink, the results show that central groove can reduce vortex, and increase the convection effect and enhance the thermal performance. It is found that higher surface area of heat sink do not promise to obtain a better cooling effect. Instead, to design a good flow field can enhance the thermal efficiency of a heat sink assembly. The experiment should be confirmed by the trend of numerical simulation in the future research. |
本系統中英文摘要資訊取自各篇刊載內容。