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題名 | 密集腳距封裝之金線結球參數分析研究=Free Air Ball Forming Process Parameter Analysis for Fine Pitch Wire Bonding |
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作 者 | 陳昭亮; 張昫揚; | 書刊名 | 興大工程學刊 |
卷期 | 12:2 2001.07[民90.07] |
頁次 | 頁127-141 |
分類號 | 446.841 |
關鍵詞 | 實驗設計法; 密集腳距; 金線結球; 銲線機; 放電產生器; Design of experience; Fine pitch; Free air ball; FAB; Wire bonder; Electric flame-off; EFO; |
語文 | 中文(Chinese) |
中文摘要 | 銲線機設計構成之關鍵技術,必須考量下列三點:(1)金線結球技術,(2)銲接技術,以及(3)銲線路徑控制技術。在本文裡,我們將探討應用於密集腳距封裝之金線結球技術。主要影響金線結球之參數有:(1)線尾長度,(2)金線線尾與電極板間之間隙大小,(3)放電產生器之放電初期電壓大小、電流大小、放電時間,(4)電極板與鋼嘴之相對位置,(5)金線材質,以及(6)鋼嘴型式。而除了後兩項為定性外,其餘均可以以定量方式來分析。因此在本文中,首先建構一實驗機臺針對前述可調整之定量參數,透過實驗設計法,尋找各參數之可調變範圍,並找出適合於密集腳距封裝所需之金球大小(約為線徑之1.5~2.0倍)之相對參數調整範圍,以為後續進行參數設定最佳化之依據。 |
英文摘要 | Three key technologies should be considered in designing a wire bonder. There are (1) Free Air Ball (FAB) forming technology, (2) Bonding technology, and (3) Loop controlling technology. In this paper, we are focusing on the FAB forming technology for fine pitch wire bonding. The parameters that affect the FAB formation include: (1) tail length; (2) spark gap; (3) Electric Flame-Off (EFO) voltage, current, time; (4) relative position between electrode plate and tail; (5) wire material; and (6) type of capillary. Except the last two items, all the other parameters can be quantified for analysis. In this paper, an experimental platform reconstructed from a manual wire bonder, is built. The parameters: (A) EFO time, (B) EFO current, (C) EFO voltage, (D) tail length, and (E) spark gap are then discussed. By using design of experiment (DOE), the adjustable range of each parameter is found, and then the range of each parameter for using in fine pitch package, which has FAB size within 1.5~2.0 times wire diameter, can be determined. The result can be used in the future for optimal parameter setting and prediction of FAB formation. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。