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頁籤選單縮合
題名 | A Study of Factors Affecting Solder Joint Fatigue Life of Thermally Enhanced Ball Grid Array Assemblies=加強熱導型球柵陣列電子構裝錫球疲勞壽命影響因子分析 |
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作者 | 鄭仙志; 江國寧; 陳韶光; 林基正; | 書刊名 | 中國工程學刊 |
卷期 | 24:4 2001.07[民90.07] |
頁次 | 頁439-451 |
分類號 | 446.01 |
關鍵詞 | 加強熱導型球柵陣列構裝; 疲勞壽命; 有限體積加權平均法; 參數化有限元素分析; Coffin-Manson法則; 雲紋干涉儀; Thermally enhanced ball grid array; Finite-volume-weighted averaging technique; Parametric finite element analysis; Solder joint reliability; Moire interferometry; Surface evolver; |
語文 | 英文(English) |